Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Automatic feeding system of automatic feeding machine for semiconductor device processing

A technology of automatic feeding and feeding, which is applied in the direction of containers, emptying containers, liquid processing, etc., can solve the problems of inability to complete quantitative feeding work, and achieve the effects of convenient processing, improved work efficiency, and high automation

Pending Publication Date: 2021-08-06
湖北福灿电子科技有限公司
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides an automatic feeding system of an automatic feeding machine for semiconductor device processing, which solves the problem of using automatic feeding when the semiconductor device is transported to the position of the feeding port of the processing equipment at present. way, but it cannot complete the problem of quantitative feeding

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Automatic feeding system of automatic feeding machine for semiconductor device processing
  • Automatic feeding system of automatic feeding machine for semiconductor device processing
  • Automatic feeding system of automatic feeding machine for semiconductor device processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] see figure 1 , the present invention provides a technical solution: an automatic feeding system of an automatic feeding machine for semiconductor device processing, including a feeding hopper 1, and both sides above the feeding hopper 1 are provided with convex plates 2, two convex plates 2 A feeding assembly 3 is provided between the upper surfaces of the feeding hopper 1, an anti-blocking assembly 4 is provided at the middle of one side of the feeding...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an automatic feeding system of an automatic feeding machine for semiconductor device processing, and relates to the technical field of semiconductor device processing and feeding. The automatic feeding system comprises a feeding hopper, wherein convex plates are arranged on the two sides of the upper portion of the feeding hopper, a feeding assembly is arranged between the upper surfaces of the two convex plates, and an anti-blocking assembly is arranged in the middle of one side face of the feeding hopper. According to the automatic feeding system, driving bevel gears are fixedly connected to the middle positions of the upper surfaces of two transmission discs, driven bevel gears corresponding to the driving bevel gears are fixedly connected to the opposite ends of two discs, the driven bevel gears are engaged with the driving bevel gears, when semiconductor devices are fed, quantitative feeding work can be conducted on the semiconductor devices, the amount of the semiconductor devices entering the feeding hopper is the same each time, manual guarding is not needed in the whole process, the automation degree is high, follow-up relevant processing work on the semiconductor devices is facilitated, and the working efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor device processing and feeding, in particular to an automatic feeding system of an automatic feeding machine for semiconductor device processing. Background technique [0002] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical characteristics of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. Semiconductor devices The semiconductor material is silicon, germanium or gallium arsenide, which can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. When performing related processing on semiconductor devices, the semiconductor devices need to be transported to the processing equipment first , and then process it. [0003] However, at present, when the s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B65G65/40B65G43/08B65G65/23B65D88/66B65G47/44
CPCB65G65/40B65G43/08B65G65/23B65D88/66B65G47/44
Inventor 王飞王锟鲁启永
Owner 湖北福灿电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products