Conductive silver paste and preparation method thereof

A technology of conductive silver paste and conductive filler, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problem of affecting the mechanical and electrical properties of nano-silver paste, affecting the connection of conductive paths, Solve problems such as conductive silver paste cracks, achieve the effect of improving floatability, increasing contact area, and promoting the completion of lap joints

Pending Publication Date: 2021-08-10
安徽中科元贞科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the flaky silver powder has problems such as easy sedimentation, easy layering and agglomeration during the curing process of the resin, which affects the connectivity of the conductive path, and the flaky silver powder is prone to shrinkage during curing, especially in a high-temperature environment, resulting in a gap between the silver powders after shrinkage. Holes can easily cause cracks and cracks in the conductive silver paste, which seriously affects the mechanical and electrical properties of the nano-silver paste

Method used

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  • Conductive silver paste and preparation method thereof
  • Conductive silver paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A electrically conductive silver paste comprising it consisting of a weight of the following weight: (a) 3 to 20 parts of the linear oligomer, (b) 20 parts of the conductive filler, (c) 1 part to 15 parts of other auxiliaries Also include a resin carrier;

[0034] The conductive filler is composed of nanoscale spherical silver powder, micron-shaped silver powder, and micrometer bar-shaped silver powder, wherein the sheet silver powder and the rod silver powder are arranged according to the ratio of (0-10: 10 ~ 0). The content of sheet silver powder and rod silver powder accounts for 20 to 75% of total quality;

[0035] The mass ratio of the compound silver powder and the spherical silver powder is (1 to 10): 1;

[0036] Among them, the particle diameter of the sheet silver powder is 2 to 4 μm, and the particle silver powder has a particle diameter of from 0.001 to 0.1 μm, the tube diameter of the silver powder is 0.02 to 0.1 μm, and the length is 1 to 5 μm.

[0037] Further...

Embodiment 2

[0041] Preparation method of conductive silver paste, including the following specific steps:

[0042] (1) Add the nanoscopic silver powder, micron-shaped sheet silver powder to the alcohol solution dispersant, treated with ball milling, and dispersion of the bar-shaped silver powder and the sheet silver powder;

[0043] (2) Add a spherical silver powder to the alcohol solution dispersant, performing an ultrasonic emulsion, forming a uniform rod silver powder dispersion emulsion, then add step (1) to disperse a uniform silver powder solution, stir, while stirring, 3 to 5 After the addition is added, the ball mill is divergently after adding silver powder;

[0044] (3) After the linear oligomer is added to the dispersant, the mixture is mixed with high speed for 30 to 80 min, and then the ground is reduced to 5 μm or less;

[0045] (4) After using a vacuum mixer to filter the remaining auxiliaries, epoxy resin, after filter defoaming treatment, the curing agent is mixed, and the cu...

Embodiment 3

[0050]According to the proportion of photo-like silver powder and rod silver powder, 6 groups of experiments according to (0 ~ 10: 10 ~ 0), the first group of experiments: sheet silver powder: rod silver powder = 10: 0, second group experiment: flake silver powder: rod Silver powder = 8: 2, third group of experiments: sheet silver powder: stick-shaped silver powder = 6: 4, fourth group of experiments: sheet silver powder: stick-shaped silver powder = 4: 6, fifth group of experiments: sheet silver powder: rod silver powder = 2: 8, sixth group of experiments: sheet silver powder: rod silver powder = 0: 10; 6 groups of conductive silver paste were obtained in accordance with the preparation method in Example 2, and 6 groups of conductive silver paste were electrically tested. The result is as shown in Table 1:

[0051] Table 1 Conductive silver paste resistivity test results

[0052] Conductive silver paste Resistivity (Ω.cm) 1 1.7*10 -3

[0053] As the conductive fil...

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Abstract

The invention discloses conductive silver paste and a preparation method thereof. The conductive silver paste is prepared from the following raw materials in parts by weight: (A) 3-20 parts of a linear oligomer, (B) 20-90 parts of a conductive filler and (C) 1-15 parts of other auxiliary agents, and further comprises a resin carrier, wherein the conductive filler is formed by compounding nano-scale spherical silver powder, micron-scale flaky silver powder and micron-scale rod-like silver powder. According to the invention, the problem that holes are formed in the middle of spherical silver powder particles after the silver paste is solidified is solved, and the defects that flake silver powder is prone to sedimentation, layering and caking are overcome; and the nanoscale spherical silver powder, the micron-sized flaky silver powder and the micron-sized rod-shaped silver powder are compounded to form a three-dimensional network cross-linked conductive path, so that the conductive effect is better.

Description

Technical field [0001] The present invention relates to the field of conductive silver paste, and more particularly to a conductive silver paste and a preparation method thereof. Background technique [0002] The conductive silver paste has a lot of demand in the field of solar energy, touch screen, and electronic packaging. This existing prospect is broad. my country's conductive silver pulp manufacturer has a wide range of manufacturers, but the high-end product core technology is still in hand in other countries, so this piece of my country has Very big progress space. [0003] As an example in the field of electronic packaging technology, currently, traditional electronic packaging materials mainly have traditional lead tin solders and lead-free solders, and emerging electronic package material conductive silver paste is a cylindrical adhesive having a certain conductive property after solidification or drying. Division, due to the conventional electronic package material, du...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 宫艺刘文明田兴友
Owner 安徽中科元贞科技有限责任公司
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