Method for manufacturing small-spacing patterns on thick copper PCB

Abstract

The invention discloses a method for manufacturing small-spacing patterns on a thick copper PCB in the technical field of PCB manufacturing. The method comprises the following steps of: film pressing: pressing a layer of dry film on the surface of a copper layer of a thick copper PCB; pattern exposure: transferring a given pattern to the surface of the copper layer with the dry film; developing: developing the dry film in the pattern covering area to expose the copper surface; tin plating: plating tin on the copper surface exposed after development to form a tin plating layer; film removing and etching: removing the dry film and etching the copper layer which is not protected by the tin coating until the thickness of the copper layer is reduced to a first set value; blind fishing: milling the copper layer protected by the tin coating according to the specified interval in the graph, wherein the thickness of the milled copper layer is reduced to a second set value; and etching and tin stripping: etching off the copper layer with the thickness of the first set value and the copper layer with the thickness of the second set value, and removing the tin plating layer. According to the invention, the influence of large lateral erosion amount on small-spacing pattern manufacturing is avoided, the machining precision of the small-spacing pattern is improved, and the manufacturing difficulty is reduced.

Description

technical field [0001] The invention belongs to the technical field of PCB board production, and in particular relates to a method for producing small-pitch graphics on a thick copper PCB board. Background technique [0002] With the rapid development of microwave, aerospace, satellite communication, power supply and high-power circuits and other fields, as well as the increasingly complex environment in which various equipment such as household appliances, military, and medical equipment are used, the performance requirements of PCB boards are becoming more and more stringent. , and the thick copper plate has extremely high elongation performance, high temperature resistance, low temperature resistance, corrosion resistance, so that the electronic equipment products have a longer service life, and it is also very helpful for the volume reduction of electronic equipment, especially the need to run Electronic products with higher voltage and current require thicker copper PCB...

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of microwave, aerospace, satellite communication, power supply and high-power circuits and other fields, as well as the increasingly complex environment in which various equipment such as household appliances, military, and medical equipment are used, the performance requirements of PCB boards are becoming more and more stringent. , and the thick copper plate has extremely high elongation performance, high temperature resistance, low temperature resistance, corrosion resistance, so that the electronic equipment products have a longer service life, and it is also very helpful for the volume reduction of electronic equipment, especially the need to run Electronic products with higher voltage and current require thicker copper PCB boards; however, due to the thicker copper thickness of the board, when making small-pitch graphics, through the normal production process, due to the large amount of side erosion, it cannot meet the needs of small-pitch

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