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A new type of browning treatment liquid for printed circuit boards

A technology for treating liquid and browning, applied in the secondary treatment of printed circuits, printed circuits, printed circuit manufacturing, etc., can solve the problems of short processing time and poor tear strength, and achieve improved peel strength and good thermal shock resistance. , the effect of increasing adsorption coverage and adsorption stability

Active Publication Date: 2019-04-23
BOMIN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims to overcome the deficiencies in the prior art, and proposes a new type of browning treatment solution that can enhance the bonding force of the inner layer of the printed circuit board. The chemical cost of the browning treatment solution is low, the reaction conditions are mild, and the treatment time Short and stable, after browning, the board surface has strong acid resistance, good browning effect, high peel strength and excellent cold and heat shock resistance, and can effectively solve the pink ring and poor tear strength of ordinary browning treatment liquids , poor acid resistance, etc., and has no pungent smell

Method used

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  • A new type of browning treatment liquid for printed circuit boards
  • A new type of browning treatment liquid for printed circuit boards
  • A new type of browning treatment liquid for printed circuit boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A novel browning treatment liquid, its composition is as follows:

[0041]

[0042]

[0043] According to the aforementioned browning treatment process, the browning solution is sprayed horizontally in the PVC browning tank to brown the pre-soaked PCB surface, the browning time is 50s, and the temperature is 35°C.

[0044] After testing, a uniform brown-black copper surface with a microetching depth of 1.44um can be obtained after browning. The surface roughness after browning was characterized by a TR200 roughness meter. The results are shown in Table 1. Using a SEM microscope to observe the copper surface, it can be observed that the copper surface has a fine and uniform honeycomb structure. These honeycomb structures endow the treated copper surface with better bonding force, which is conducive to increasing the copper / resin bond during the lamination process. The specific surface area of ​​the indirect contact can promote the cross-linking reaction between the...

Embodiment 2

[0046] A novel browning treatment liquid, its composition is as follows:

[0047]

[0048] According to the aforementioned browning treatment process, the browning solution is sprayed horizontally in the PVC browning tank to brown the pre-soaked PCB surface, the browning time is 40s, and the temperature is 35°C.

[0049] The results show that after browning, a uniform brown-black copper surface with a microetching depth of 1.21um can be obtained. The surface roughness after browning is characterized by TR200 roughness meter. The surface has a fine and evenly distributed honeycomb structure. These honeycomb structures endow the treated copper surface with better bonding force, which is beneficial to the pressing of multi-layer boards and prevents the occurrence of burst boards, indicating that the browning liquid has good bonding strength; after lamination, the peel strength between the copper surface and the prepreg is 5.9Ib / in; under the condition of 288 ℃, it can satisfy ...

Embodiment 3

[0051] A novel browning treatment liquid, its composition is as follows:

[0052]

[0053] According to the aforementioned browning treatment process, the browning solution is sprayed horizontally in the PVC browning tank to brown the pre-soaked PCB surface, the browning time is 50s, and the temperature is 35°C.

[0054] The results show that after browning, a uniform brown-black copper surface with a microetch depth of 1.12um can be obtained. The surface roughness after browning was characterized by a TR200 roughness meter. The results are shown in Table 1. Using SEM microscope to observe the copper surface, it can be seen that the copper surface has a fine and evenly distributed honeycomb structure. These honeycomb structures endow the treated copper surface with better bonding force, which is beneficial to the lamination of multi-layer boards and prevents the occurrence of burst boards. , indicating that the browning solution has a good bonding force; the peel strength b...

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Abstract

The invention discloses a novel browning treatment fluid for a printed circuit board. Each liter of the browning treatment fluid comprises, by volume or mass, 35-65 ml of H2SO4, 35-60 ml of H2O2, 100-200 mg of CuSO4.5H2O, 3-6 g of ethylene glycol monomethyl ether, 5-10 g of methyl triethoxysilane, 13-19 g of benzotriazole, 0.5-10 g of an inhibitor and 1.2-1.5 g of EDTA, wherein the inhibitor comprises 2-sulfydryl-5-benzimidazole sodium sulfonate dehydrate and amino acid containing N and O heteroatoms. The cost of chemicals adopted by the browning treatment fluid is low, the reaction condition is mild, the treatment time is short, and treatment is stable; the surface of the board is high in acid resistance after the board is browned, the browning effect is good, and high peeling strength and excellent cold-heat impact resistance are achieved; and the problems of pink rings, poor tearing strength, poor acid resistance and the like of an ordinary browning treatment fluid can be effectively solved, and the novel browning treatment fluid has no pungent odor.

Description

technical field [0001] The invention belongs to the field of a printed circuit board (PCB) inner layer treatment liquid, in particular, the invention relates to a novel browning treatment liquid for a printed circuit board. Background technique [0002] With the development of society and science and technology, electronic products are increasingly miniaturized. This development trend has also led to the development of printed circuit boards for connecting different devices and substrates for semiconductor chip packaging under the premise of ensuring good electrical and thermal properties. Develop in the direction of light, thin, short and small. In order to meet the above requirements, HDI boards are gradually developing towards higher density and high quality. [0003] In the manufacture of printed boards, the manufacture of multilayer boards has always occupied a very important position. Improving and enhancing the interlayer bonding force has always been an important in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C22/52H05K3/38
CPCC23C22/52H05K3/385
Inventor 罗莉陈世金陈际达张胜涛韩志伟周国云陈苑明
Owner BOMIN ELECTRONICS CO LTD