Film layer removing process for silicon-based OLED micro-display device

A technology for micro-display devices and film layers, which is applied in the manufacturing of electric solid-state devices, semiconductor devices, and semiconductor/solid-state devices, etc., can solve the problems of low film removal efficiency, large number of occupied equipment, abnormal peeling of packaging layers, etc., to avoid Poor etching, reducing process costs, and avoiding abnormal damage to the encapsulation layer
CN113290316AActive Publication Date: 2021-08-24ANHUI SEMICON INTEGRATED DISPLAY TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ANHUI SEMICON INTEGRATED DISPLAY TECH CO LTD
Publication Date
2021-08-24

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Abstract

The invention discloses a film layer removing process for a silicon-based OLED micro-display device, and belongs to the technical field of silicon-based OLED micro-display device preparation. The film layer removing process comprises the following steps of feeding a wafer to be processed, positioning the wafer on a work platform, and completing laser alignment; starting a laser system, conducting single-point multi-time laser operation on the target film layer to remove the target film layer, and conducting nitrogen purging on an operation area; conducting wet cleaning operation on the wafer of which the film layer is removed by the laser; and conducting baking operation on the cleaned wafer. The film layer removing process has the beneficial effects that the film layer removing process is simple, the film layer removing efficiency is high, poor etching and packaging layer damage abnormity can be avoided, the product yield is improved, and meanwhile, the process cost is reduced.
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Description

technical field

[0001] The invention relates to the technical field of preparation of a silicon-based OLED microdisplay device, in particular to a process for removing a film layer of a silicon-based OLED microdisplay device. Background technique

[0002] At present, due to the vigorous development of the micro-display industry, silicon-based OLED micro-display devices have received extensive attention, and the methods for their fabrication are also being continuously explored and improved. In the manufacturing process of silicon-based OLED micro-display devices, in the display module preparation section, it is necessary to attach each die in the wafer to a PCB or FPC. The base layer is exposed, and the remaining film layers cannot be placed.

[0003] Therefore, before the module process, it is necessary to remove the high-temperature SiOx film layer and the packaging film layer above the wiring area. The process of removing the above film layer is currently conventionally...

Claims

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