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Codeposition promoter for composite electroplating to prepare copper-base composite material

A technology of copper-based composite materials and co-deposition accelerators, applied in the direction of electrolytic coatings, coatings, etc., can solve the problems of insufficient composite electroplating, less solid particle deposition, and low solid particle content, and improve the surface finish , promote co-deposition, increase the effect of content

Inactive Publication Date: 2003-12-31
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In some composite electroplating systems, in the absence of co-deposition accelerators, although co-deposition of matrix metal and solid particles can occur, the amount of solid particles deposited is small, and the content of solid particles in the coating is very low, which cannot meet the actual needs.
In addition, in some composite electroplating systems, if the co-deposition accelerator is not added to the electroplating bath, or the co-deposition accelerator added is not suitable, the content of solid particles in the composite coating is zero or very little, and the purpose of composite electroplating cannot be achieved.
As introduced in the paper "Research on SiC Particle Reinforced Copper Matrix Composite Preparation by Electroforming" (Hu Guohua, Master of Engineering Thesis, Shanghai Jiaotong University, 2001), only triethanolamine or hexamethylene was added to the plating solution. Tetramine, SiC in coating p The maximum content is only 9% and 5% (volume percentage), and the performance of the resulting material is not ideal

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The components of mixed co-deposition accelerator are:

[0015] Cationic fluorocarbon surfactant: 2.5g / L;

[0016] Triethanolamine: 50ml / L;

[0017] Hexamethylenetetramine: 25g / L.

[0018] SiC in the resulting composite coating p The content is 26% (volume percentage), and SiC p Evenly distributed in the composite coating. Example 2:

Embodiment 2

[0019] The components of mixed co-deposition accelerator are:

[0020] Cationic fluorocarbon surfactant: 3.5g / L;

[0021] Triethanolamine: 65ml / L;

[0022] Hexamethylenetetramine: 30g / L.

[0023] SiC in the resulting composite coating p The content is 29% (volume percentage), and SiC p Evenly distributed in the composite coating.

Embodiment 3

[0025] The components of mixed co-deposition accelerator are:

[0026] Cationic fluorocarbon surfactant: 3.5g / L;

[0027] Triethanolamine: 65ml / L;

[0028] Hexamethylenetetramine: 30g / L;

[0029] Thiourea: 10mg / L.

[0030] SiC in the resulting composite coating p The content is 25% (volume percentage), and SiC p Evenly distributed in the composite coating. SiC in the composite coating obtained by using the mixed co-deposition accelerator p Although the content is slightly decreased, compared with the effect of the mixed co-deposition accelerator prepared in 1 and 2, the surface smoothness and smoothness of the obtained material are relatively better.

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Abstract

The codeposition promoter for preparing copper base composition material by means of compound electroplating (electroforming) process comprises cationic fluorocarbin surfactant 1-5 g / L, triethanolamine 30-80 ml / L, hexamethyl tetramine 10-50 g / L and sulfourea 0-30 mg / L. Said promotor can effectively promote codeposition of SiCp and metal copper, can greatly increase SiCp content in the composite deposit and can make SiCp uniformly distribute in base body metal copper to raise the physical and mechanical properties of Cu / SiCp composite material, and at the same time improve surface degree of finished of composite deposit.

Description

Technical field: [0001] The invention relates to a co-deposition accelerator for preparing copper-based composite materials by composite electroplating, which can be used for preparing Cu / SiC by composite electroplating p Composite materials, and can also be used for composite electroforming to prepare Cu / SiC p composite material, it can effectively promote SiC p Co-depositing with metal copper to increase the content of solid particles in the composite coating belongs to the technical field of composite electroplating. Background technique: [0002] The content of solid particles has a great influence on the physical and mechanical properties of composite coatings. In some composite electroplating systems, in the absence of co-deposition accelerators, co-deposition of matrix metal and solid particles can occur, but the amount of solid particles deposited is small, and the content of solid particles in the coating is very low, which cannot meet the actual needs. In additi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D15/00
Inventor 胡文彬胡国华朱建华沈彬刘磊
Owner SHANGHAI JIAOTONG UNIV