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Preparation method of diamond-metal high-temperature solid-state interface reaction sample

An interfacial reaction and sample preparation technology, applied in the preparation of test samples, chemical method analysis, sampling, etc., can solve problems such as environmental pollution and powder oxidation, and achieve the effect of avoiding displacement

Pending Publication Date: 2021-08-27
HUAQIAO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the metal powder and diamond reaction system, due to the size effect of the metal powder, most metals will form micro-droplets on the diamond surface, that is, a solid (diamond)-liquid (powder droplet) reaction system is established on a microscopic scale. However, there are few studies on the solid-state (diamond)-solid-state (solid-state metal) system.
At the same time, using powder metal to react with diamond will easily cause environmental pollution and powder oxidation during the experiment.

Method used

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  • Preparation method of diamond-metal high-temperature solid-state interface reaction sample
  • Preparation method of diamond-metal high-temperature solid-state interface reaction sample
  • Preparation method of diamond-metal high-temperature solid-state interface reaction sample

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Embodiment Construction

[0038] Please check Figure 1 to Figure 5 , The clamping device includes a stage 1, a sample fixing nail 2, a nail seat 3, a nail seat fixing nail 4 and a fixed pressure head 5.

[0039] The object stage 1 comprises a body and two columns fixed on the platform body at intervals horizontally, and the facing side walls of the two columns are concavely provided with loading grooves 11; the two ends of the nail base 3 are loaded into the device into the groove 11; the sample fixing nail 2 can be adjusted up and down through the nail seat 3, the lower end of the sample fixing nail 2 is connected to the fixed pressure head 5, the diamond 6 and the metal 7 are stacked up and down on the table body, and the sample fixing nail is rotated 2. The fixed indenter 5 is pressed against the diamond 6. On the one hand, it can adapt to different sample heights. On the other hand, it can adjust the pressing force to adapt to different hardness metals; The through groove 12 of the nail holder 4 ...

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Abstract

The invention discloses a preparation method of a diamond-metal high-temperature solid-state interface reaction sample. The preparation method comprises the steps of processing diamond and metal into flat blocks or sheets; processing the diamond and the metal to enable the parallelism of the diamond and the metal to meet preset requirements; grinding and polishing the diamond and metal contact surface which is about to be subjected to high-temperature solid interface reaction; performing ultrasonic cleaning on the diamond and the metal by adopting an acetone solution and drying; assembling the diamond and the metal, and guaranteeing that the contact surfaces of the diamond and the metal make full contact; placing the assembled diamond and metal in a vacuum heating furnace for aging or variable-temperature treatment to obtain a high-temperature solid interface reaction sample; and observing the morphology of the sample and analyzing the components of the sample. The device has the advantages that the method is suitable for a solid-solid reaction system in a diamond-metal reaction system, and the diamond-metal reaction test process is perfected.

Description

technical field [0001] The invention relates to the technical field of diamond-metal reaction mechanism research, in particular to a diamond-metal high-temperature solid-state interface reaction sample preparation method. Background technique [0002] Diamond is the hardest substance in nature and has good physical properties and stable chemical properties, so it can be widely used in the field of tool preparation. Moreover, diamond has the advantages of wide band gap and high thermal conductivity, and can be used in the preparation of optical and semiconductor components for extreme occasions, such as lenses in Raman laser instruments and other precision instruments. Therefore, the processing of diamond semiconductors has become an urgent problem to be solved at this stage. [0003] At present, the commonly used diamond processing methods mainly include the following methods: salt corrosion processing, metal solid-state catalytic processing, chemical processing, mechanoche...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N31/00G01N1/32G01N1/28G01B5/25
CPCG01B5/25G01N1/28G01N1/286G01N1/32G01N31/00
Inventor 穆德魁刘卓程伟廖信江徐西鹏
Owner HUAQIAO UNIVERSITY
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