Semiconductor optical fiber coupling laser and optical fiber laser

A fiber laser and fiber coupling technology, which is applied to lasers, laser components, laser components, etc., can solve the problems of large volume, high cost, and heavy weight of high-power fiber lasers, and achieve shortened heat transfer paths, reduced weight and Small size, the effect of realizing high integration and high power output

Pending Publication Date: 2021-09-03
BWT BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These issues combine to make high-power fiber lasers heavy, bulky, and expensive

Method used

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  • Semiconductor optical fiber coupling laser and optical fiber laser
  • Semiconductor optical fiber coupling laser and optical fiber laser
  • Semiconductor optical fiber coupling laser and optical fiber laser

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0103] combine Figure 3 to Figure 5 As shown, this embodiment discloses a semiconductor fiber-coupled laser 11 . The semiconductor fiber coupled laser 11 includes six optical modules 111 , a cold plate 112 and a cover plate 113 . The six optical modules 111 are sequentially arranged on the upper surface of the cold plate 112 along the length direction of the cold plate 112 . The cover plate 113 adopts a thin shell structure and is connected to the cold plate 112 with the opening facing downward, and the six optical modules 111 are integrally packaged by the cover plate 113 and the cold plate 112 .

[0104] Each optical module 111 includes a COS module 1111 directly connected to the cold plate 112, an optical path array 1112, an electrode 1113, a pigtail 1114, and an optical fiber support 1115, and the COS module 1111, the optical path array 1112, The electrodes 1113, pigtails 1114 and fiber holders 1115 are the same as the COS module, optical path array, electrodes, pigtail...

Embodiment 2

[0112] combine Figure 6 to Figure 9 As shown, this embodiment discloses a semiconductor fiber-coupled laser 12 . The semiconductor fiber coupled laser 12 includes six optical modules 121 , a cold plate 122 and a cover plate 113 . The six optical modules 121 are sequentially arranged on the upper surface of the cold plate 122 along the length direction of the cold plate 122 . The cover plate 113 adopts a thin shell structure and is connected to the cold plate 122 with the opening facing downward, and the six optical modules 121 are integrally packaged by the cover plate 113 and the cold plate 122 .

[0113] Compared with Embodiment 1, the optical module 121 of this embodiment further includes a heat conducting component 1211 . Wherein, the heat conduction component 1211 is located between the COS module 1111 and the cold plate 122 as a component with high heat conduction performance, and is used for the fixed connection between the COS module 1111 and the cold plate 122 .

...

Embodiment 3

[0120] combine Figure 10 to Figure 13 As shown, this embodiment discloses a semiconductor fiber-coupled laser 13 . The semiconductor fiber coupled laser 13 includes six optical modules 131 , a cold plate 132 and a cover plate 113 . The six optical modules 131 are sequentially arranged on the upper surface of the cold plate 132 along the length direction of the cold plate 132 . The cover plate 113 adopts a thin shell structure and is connected with the cold plate 132 with the opening facing downward, and the six optical modules 131 are integrally packaged by the cover plate 113 and the cold plate 132 .

[0121] Compared with the second embodiment, the heat conducting component 1311 in the optical module 131 of this embodiment is provided with two bolt holes 13111 , and at the same time, a corresponding threaded hole 1322 is provided at the mounting groove 1321 of the cold plate 132 .

[0122] At this time, after inserting the heat conduction component 1311 into the installat...

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Abstract

The invention discloses a semiconductor optical fiber coupling laser and an optical fiber laser. The semiconductor optical fiber coupling laser comprises an optical module, a cold plate and a cover plate, the cover plate and the cold plate are used for packaging the optical module by adopting a cold plate direct pumping (DPoC) technology and a one-plate multi-pump (MPoC) technology, a tube shell packaging structure of a conventional pumping module is canceled, the cost, and the weight and the size of the semiconductor optical fiber coupling laser are reduced. Meanwhile, the heat transfer path of the semiconductor laser single tube is shortened, the junction temperature of the semiconductor laser single tube is effectively reduced, the reliability of the laser is improved, the service life of the laser is prolonged, and high-integration and high-power output of the semiconductor optical fiber coupling laser is achieved; a semiconductor optical fiber coupling laser using the DPoC technology and the MPoC technology serves as a pumping source, meanwhile, an active optical fiber is wound around a cold plate, heat dissipation is conducted on the active optical fiber through the cold plate, the cost, the weight and the size of the optical fiber laser are greatly reduced, and high-integration and high-power output of the optical fiber laser is achieved.

Description

technical field [0001] The invention belongs to the technical field of lasers, and in particular relates to a semiconductor fiber coupled laser and a fiber laser. Background technique [0002] Laser has the advantages of good beam quality, high efficiency, and high stability, and is widely used in laser optical fiber communication, laser space long-distance communication, laser engraving, laser marking, automobile manufacturing and other fields. Among them, fiber lasers generally use multiple semiconductor laser pump sources to pump active fibers through optical fiber bundles to obtain high power output. [0003] combine figure 1 with figure 2 As shown, the current multi-pump assembly 10 includes a cold plate 102 and a plurality of semiconductor laser pump sources 101 fixed on the cold plate 102, while the conventional semiconductor laser pump source 101 usually adopts a tube shell 1011 with a stepped structure to the COS (Chip On Submount) modules, optical path arrays, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S3/067H01S3/04H01S3/042H01S3/0941
CPCH01S3/067H01S3/06704H01S3/0407H01S3/042H01S3/0941
Inventor 陈晓华于振坤王江云张一翔王宝华时敏段云锋郎超赵巨云
Owner BWT BEIJING
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