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Pocking mark eliminating process for photosensitive resin lens

A photosensitive resin, resin lens technology, applied in optics, lenses, manufacturing tools, etc., can solve the problem of lens pitting and affecting the normal use of the lens, and achieve the effect of maintaining strength, less consumption of raw materials, and eliminating pitting

Pending Publication Date: 2021-09-07
超丰微纳科技(宁波)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, thermosetting resin lenses have the advantages of high curing strength of monomers and are convenient for mass processing and production. However, during the production process of existing lenses, pitting may occur on the lens, which will affect the normal use of the lens. Therefore, We propose a photosensitive resin lens pitting elimination process to solve the above problems

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] In embodiment 1, a kind of process for eliminating pitting of photosensitive resin lens comprises the following steps:

[0022] S1. Determine the center point between the pits, and then carry out the scribing operation. The depth of the scribing is 0.5mm. The cross center of the scribing operation is aligned with the center point between the pits of the resin lens, and the horizontal line is aligned with the process line. The diamond particles of the cutting knife are cut close to the template;

[0023] S2. After the edge marking in step S1 is completed, use pliers to break the edge along the marking, hold the piece in the left hand, hold the pliers in the right hand, pull the cut outward, and then use the pliers to align the interface;

[0024] S3. Use diamond grinding discs for edging. Hold the resin lens with both hands to keep the position of the lens stable. The angle between the resin lens and the grinding wheel is 40 degrees for edging. When edging, use the atomi...

Embodiment 2

[0033] In embodiment 2, a kind of process for eliminating pitting of photosensitive resin lens comprises the following steps:

[0034] S1. Determine the center point between the pits, and then carry out the scribing operation. The depth of the scribing is 3mm. The cross center of the scribing operation is aligned with the center point between the pits of the resin lens. The horizontal line is aligned with the process line, and the cutting The diamond particles of the knife are cut close to the template;

[0035] S2. After the edge scribing in step S1 is completed, use pliers to break the edge along the scribing, hold the piece in the left hand, hold the pliers in the right hand, pull the cut outward, and then use the pliers to align the interface;

[0036] S3. Use diamond grinding discs for edging. Hold the resin lens with both hands to keep the position of the lens stable. The angle between the resin lens and the grinding wheel is 50 degrees for edging. When edging, use the a...

Embodiment 3

[0045] In embodiment 3, a kind of process for eliminating pitting of photosensitive resin lens comprises the following steps:

[0046] S1. Determine the center point between the pits, and then carry out the scribing operation. The depth of the scribing is 0.5-3mm. The cross center of the scribing operation is aligned with the center point between the pits of the resin lens, and the horizontal line is aligned with the process line. , the diamond particles of the cutting knife are cut close to the template;

[0047] S2. After the edge scribing in step S1 is completed, use pliers to break the edge along the scribing, hold the piece in the left hand, hold the pliers in the right hand, pull the cut outward, and then use the pliers to align the interface;

[0048] S3. Use diamond grinding discs for edging. Hold the resin lens with both hands to keep the position of the lens stable. The angle between the resin lens and the grinding wheel is 45 degrees for edging. When edging, use the...

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Abstract

The invention relates to the technical field of photosensitive resin lenses, in particular to a pocking mark eliminating process for a photosensitive resin lens, which comprises the following steps: S1, determining a central point between pocking marks, then carrying out edge drawing operation, aligning a cross center of the edge drawing operation with the central point between the pocking marks of the resin lens, aligning a horizontal line with a process line, and cutting the diamond particles of a cutting knife close to a sample plate; S2, after edge cutting in the step S1 is completed, adopting a pair of pliers for edge breaking along the marks, holding the piece in the left hand, holding the pliers in the right hand, conducting outward tension shearing and then clamping a joint to be aligned through the pliers; S3, adopting a diamond grinding piece for edge grinding, holding the resin lens with two hands, keeping the stability of the position of the lens; during edge grinding, adopting an atomizing nozzle to align at the grinding position for dehumidification treatment, and comparing the lens with a spectacle frame while being ground. The process is convenient and simple in operation process, few in procedure and low in raw material consumption, and can effectively keep the strength of the lens, so that the lens can be normally used and is suitable for popularization and application.

Description

technical field [0001] The invention relates to the technical field of photosensitive resin lenses, in particular to a process for eliminating pitting of photosensitive resin lenses. Background technique [0002] Optical lenses are transparent optical components with one or more curved surfaces made of glass materials, high-end resin materials, rare technical materials, etc., which have the functions of focusing, collimating and scattering light. , security monitoring and core components on AR / VR glasses. [0003] Resin lens is a kind of lens made of organic materials. The interior is a polymer chain structure, which is connected to form a three-dimensional network structure. The intermolecular structure is relatively loose, and there is a space for relative displacement between the molecular chains. The light transmittance is 84%-90%, the light transmittance is good, and the optical resin lens has strong impact resistance. [0004] Photosensitive resin means that the mate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B9/14B24B13/00B24B13/005B24B55/02
CPCB24B9/14B24B9/146B24B13/00B24B13/0055B24B55/02
Inventor 阮本帅洪超
Owner 超丰微纳科技(宁波)有限公司
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