Method for manufacturing electronic equipment shell, electronic equipment shell and electronic equipment
A technology for electronic equipment and housing, applied in the field of electronic equipment housing and electronic equipment, can solve the problems of fragility, difficulty in making ceramics into 3D structures, and inability to achieve mass production applications in large quantities.
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Embodiment 1
[0055] The method for making electronic equipment casing: 1000g ZrO 2 Placed in the plasma chamber, pass into argon as a carrier gas, and pass water plasma into the plasma chamber for ZrO 2 Carry out hydroxylation treatment to obtain the first preform, wherein the temperature of the plasma surface treatment is 70°C, the plasma power is 30W, the flow rate is 2.5g / h, and the treatment time is 2min; then 25g of silane coupling agent is dissolved In the alcohol-water mixed solvent, add the first prefabricated material, mix thoroughly and dry to obtain the second prefabricated material; mix the second prefabricated material with 500g polyphenylene sulfide to obtain the prefabricated mixture, and banbury the prefabricated mixture processing to obtain the third prefabricated material, wherein the banburying treatment is carried out under vacuum conditions, and the temperature of the banburying treatment is 300°C; the third prefabricated material obtained by banbury mixing is put into...
Embodiment 2
[0057] The difference from Example 1 is only that the temperature of the plasma surface treatment is 80°C.
Embodiment 3
[0059] The difference from Example 1 is only that the temperature of the plasma surface treatment is 90°C.
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