Collimating film, interference-reducing collimating film, laminated collimating film and hole-sealing laminated collimating film

A straight hole, laminating technology, applied in the field of image recognition, can solve the problem of difficult alignment of two layers of collimating diaphragms

Active Publication Date: 2021-09-10
NINGBO EXCITON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem of difficult alignment of the two layers of collimating diaphragms in traditional rigid collimating sheets, the present invention provides a collimating film, a collimating film for reducing interference, a bonding type collimating film and a sealing hole Laminated Alignment Film
The collimating film provided by the present invention only includes one layer of collimating holes, which solves the problem of difficult alignment of two layers of collimating diaphragms

Method used

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  • Collimating film, interference-reducing collimating film, laminated collimating film and hole-sealing laminated collimating film
  • Collimating film, interference-reducing collimating film, laminated collimating film and hole-sealing laminated collimating film
  • Collimating film, interference-reducing collimating film, laminated collimating film and hole-sealing laminated collimating film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0204] Such as Figure 6 Shown is the collimating film provided by the present invention, including a collimating lens layer 41, a flexible substrate layer 42 and a collimating hole layer 43, the collimating lens layer is placed on the upper surface of the substrate, and the collimating hole layer is placed on the lower surface of the substrate , the collimating lens layer 41 includes a microlens array 41A and a thickness 41B, and the collimating hole layer 43 includes a light-shielding medium 43A and a collimating hole array (consisting of a certain number of collimating holes 43B) formed after hollowing out the medium; The thickness T of the flexible base layer is 25 μm. The collimating lens array and the collimating hole array of the collimating film are regular triangles closely arranged (such as Figure 8 shown). The minimum pitch P of the principal optical axis of the microlens is 18 μm, the radius of curvature R is 12.6 μm, the thickness H of the collimating lens laye...

Embodiment 2-24

[0213] For the collimating film provided in Example 1, the collimating lens array and the collimating hole array in the collimating film are closely arranged in regular triangles, the material of the collimating lens layer 41 is PMMA, and the flexible matrix layer 42 The material is PET, and the light-shielding medium 43A of the collimating hole layer 43 is titanium carbide with inorganic coating. The collimating film adopts the microlens punching method to drill collimating holes 43B. The other parameters are listed in Table 1.

[0214] Design parameters and optical properties of Table 1 Embodiment 1~24

[0215]

[0216]

[0217] Note 1: P is the minimum distance between the main optical axes of the microlens, in μm; R is the radius of curvature of the microlens, in μm; H is the thickness of the collimating lens layer, in μm; n1 is the refractive index of the collimating lens layer, infinite T is the thickness of the flexible base layer, in μm; n2 is the refractive inde...

Embodiment 25-30

[0220] For the collimating film provided in Example 1, the collimating lens array and the collimating hole array in the collimating film are closely arranged in regular triangles, the material of the collimating lens layer 41 is PMMA, and the material of the flexible base layer 42 is It is PET, and the light-shielding medium 43A of the collimating hole layer 43 is titanium carbide with inorganic coating. The collimating film adopts the microlens punching method to punch the collimating hole 43B. The other parameters are listed in Table 2.

[0221] Design parameters and optical properties of table 2 embodiment 25~30

[0222]

[0223] Note 1 is the same as Table 1.

[0224] As shown in Table 2, it is Examples 25-30 with different flexible substrate thicknesses. Examples 25-27 are respectively P=10 μm, and other parameters are constant, and a group of collimating films of T=10, 15, and 20 μm. Embodiments 28-30 are respectively P=25 μm, and other parameters are constant. Belo...

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Abstract

The invention belongs to the field of image recognition, and particularly relates to a collimating film, an interference-reducing collimating film, a laminated collimating film and a hole-sealing laminated collimating film. The invention provides a collimating film, an interference-reducing collimating film, a laminated collimating film and a hole-sealing laminated collimating film in order to solve the problem of bubbles of a laminated collimating film designed by adopting a relatively thick light shielding layer. The hole-sealing laminated collimating film comprises a collimating film, a flat layer and a laminating adhesive layer, wherein the lower surface of the flat layer is smooth and flat, the upper surface of the flat layer is in full contact with the lower surface of the shading medium and the lower surface of the substrate layer in the area of the collimating hole, and the collimating hole is fully filled by the flat layer; and the lower surface of the flat layer is laminated to the laminating adhesive layer. The raw material of the flat layer is selected from a solvent-free low-viscosity transparent resin system. The hole-sealing laminated collimating film provided by the invention is applied to an image recognition module, so that the recognition accuracy of the image recognition module is high.

Description

technical field [0001] The invention belongs to the field of image recognition, and in particular relates to an alignment film, an interference-reducing alignment film, a bonding type alignment film and a hole-sealing bonding type alignment film. Background technique [0002] In the field of image recognition, commonly used image sensors such as CMOS type or photo-TFT type generally contain collimation devices in the sensor module to enhance the signal-to-noise ratio, improve the recognition rate, and reduce crosstalk. The function of the collimation device (such as figure 1 shown) is mainly to collimate and filter the diffuse light at the single pixel of the image, and the normal collimated light or light (signal) close to collimation can be smoothly transmitted to the corresponding photoelectric sensor, and the deviation from the normal Directional high-angle light (noise) can only rarely or even not enter the non-corresponding photoelectric sensor, thereby enhancing the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B27/30G02B3/00G02B1/10G06K9/00
CPCG02B3/0037G02B3/0006G02B3/00G02B1/10G02B27/30C09J7/29Y02E10/549Y02P70/50
Inventor 李刚夏寅高斌基付坤赵国林王小凯唐海江张彦
Owner NINGBO EXCITON TECH
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