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Method for connecting polysilazane with silicon carbide

A technology of polysilazane and silicon carbide, which is applied in the field of polysilazane connection with silicon carbide, can solve problems such as low fracture toughness, brittle fracture, and affecting processing quality, and achieve high connection strength

Inactive Publication Date: 2021-09-24
GUANGDONG UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Most of the preparation methods of silicon carbide composite materials adopt the preparation method of near-net shape, but in order to meet the requirements of high-precision assembly and use, it generally requires secondary processing to meet the requirements of its surface quality and size and shape accuracy. During the processing process, because SiC material not only has the characteristics of high hardness, high brittleness and low fracture toughness, it is also easy to cause brittle fracture of the material during the grinding process, leaving a surface broken layer on the surface of the material, and causing more serious damage. Surface and sub-surface damage will affect the processing accuracy and seriously affect its processing quality. Therefore, it is usually necessary to make these parts through the connection technology between ceramics

Method used

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  • Method for connecting polysilazane with silicon carbide
  • Method for connecting polysilazane with silicon carbide
  • Method for connecting polysilazane with silicon carbide

Examples

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Embodiment 1

[0024] The silicon carbide used in this example is pressureless silicon carbide. After the silicon carbide is cut, it is ultrasonically cleaned in alcohol, dried with gauze, and polysilazane is dropped on the surface of the silicon carbide with a rubber dropper. Silazane is uniformly diffused on the surface of the silicon carbide substrate to obtain a pressureless silicon carbide substrate coated with polysilazane; then two pressureless silicon carbide substrates coated with polysilazane are stacked together to obtain Sample; put the sample in a graphite crucible, and apply 0.1N axial force on the sample, in the debinding furnace, at a heating rate of 1°C / min, raise the temperature to 140°C for cross-linking and curing; after cross-linking and curing The sample is placed in the 1500°C tube furnace of Huan Technology, and the axial force of 0.1N is also applied to the sample, and then heat treatment is carried out under the nitrogen atmosphere (the atmosphere flow rate of nitrog...

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Abstract

The invention belongs to the field of ceramic materials, and discloses a method for connecting polysilazane with silicon carbide. The method comprises the steps of smearing polysilazane on cleaned non-pressure silicon carbide substrates, then stacking two non-pressure silicon carbide substrates smeared with the polysilazane together in a smearing mode, and placing in a graphite crucible, applying 0.1 N axial force to a sample, heating the sample to 140 DEG C at the heating rate of 1 DEG C / min in the air environment, conducting heat preservation for 16-28 h, and conducting cross-linking curing; and placing a cross-linked and cured sample in a tubular furnace, applying 0.1 N axial force to the sample in a nitrogen atmosphere, heating to 240 DEG C at a heating rate of 1 DEG C / min, keeping the temperature for 1 h, then heating to 500 DEG C at the heating rate of 1 DEG C / min, keeping the temperature for 1 h, finally heating to 1300 DEG C at the heating rate of 1 DEG C / min, keeping the temperature for 2 h, and carrying out high-temperature sintering. The experimental connection method is simple to operate, and the sample can obtain higher connection strength.

Description

technical field [0001] The invention belongs to the field of ceramic materials, in particular to a method for connecting polysilazane to silicon carbide. Background technique [0002] In modern high-temperature structural materials, silicon carbide materials are due to their high elastic modulus, moderate density, small thermal expansion coefficient, high thermal conductivity, thermal shock resistance, high specific stiffness, and high dimensional stability. And a series of excellent physical properties such as isotropy of thermal and mechanical properties, widely used in ceramic ball bearings, valves, semiconductor materials, gyroscopes, measuring instruments, aerospace and other fields, has become an irreplaceable in many industrial fields s material. Silicon carbide has excellent physical and chemical properties: [0003] Mechanical properties: high hardness (Kirvin's hardness is 3000kg / mm2), can cut rubies; high wear resistance, second only to diamond. [0004] Therma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/00
CPCC04B37/008C04B37/003C04B2237/04C04B2237/32
Inventor 程艳玲黄豪贤杨盛凯雷骏习鑫鑫郭伟明林华泰
Owner GUANGDONG UNIV OF TECH
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