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Photosensitive resin composition for ink jet and printed wiring board

A technology of photosensitive resin and composition, which is applied in the direction of photosensitive materials, optics, and optomechanical equipment used in optomechanical equipment, and can solve the problems of anti-seepage of cured coating film and insufficient particle refinement, etc. It achieves the effects of excellent flame retardancy, excellent coating property and excellent anti-bleeding property

Pending Publication Date: 2021-09-28
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, even if the powdered flame retardant is pulverized, the particles cannot be sufficiently refined, and there is room for improvement in stably ejecting a flame-retardant photosensitive resin composition using the inkjet method.
In addition, depending on the type of flame retardant, the flame retardant may bleed out from the solder resist film, causing problems in the anti-bleeding property of the cured coating film.

Method used

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  • Photosensitive resin composition for ink jet and printed wiring board
  • Photosensitive resin composition for ink jet and printed wiring board
  • Photosensitive resin composition for ink jet and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0123] The epoxy acrylate A of 15 mass parts, the (meth) acrylic compound A of 73 mass parts, the phosphorus-containing compound A of 20 mass parts, the photopolymerization initiator A of 5 mass parts, the photopolymerization initiator A of 5 mass parts C, 1 part by mass of coloring pigment A and 1 part by mass of coloring pigment B were put into a container, pre-mixed with a mixer, and then mixed and dispersed at room temperature using a three-roll mill to obtain a photosensitive resin for inkjet. combination.

Embodiment 2～12

[0125] Except having mixed each material in the composition shown in Table 1, it carried out similarly to Example 1, and obtained the photosensitive resin composition for inkjet.

Embodiment 13～24

[0127] Except having mixed each material in the composition shown in Table 2, it carried out similarly to Example 1, and obtained the photosensitive resin composition for inkjet.

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Abstract

A photosensitive resin composition for ink jet contains (A) a (meth) acrylic resin having a weight-average molecular weight of 500 or more, (B) a (meth) acrylic compound having a weight-average molecular weight of less than 500, (C) a phosphorus-containing compound, and (D) a photopolymerization initiator, the component (C) being a compound other than a phosphoric acid ester And a compound having, in one molecule, a functional group capable of reacting by photoradical polymerization or photocationic polymerization.

Description

technical field [0001] The present invention relates to a photosensitive resin composition for inkjet and a printed wiring board. Background technique [0002] As a photosensitive resin composition for forming a solder resist film etc. on a printed wiring board, various characteristics, such as solder heat resistance and adhesiveness with an insulating base material or a conductor layer, are required. This photosensitive resin composition is currently applied by a screen printing method or the like, but in recent years, techniques for applying it by an inkjet method have also been studied. [0003] As a photosensitive resin composition suitable for the inkjet method, for example, a curable composition including (A) a photobase generator, (B) an epoxy group-containing (methanol) has been proposed. base) an acrylate compound, (C) a photopolymerization initiator, and (D) a thermosetting component (except for (B) a (meth)acrylate compound having an epoxy group) (Reference Docum...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004
CPCG03F7/027G03F7/004
Inventor 冈本吉生荣西弘
Owner TAMURA KK
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