Laser pulse deposition system and processing method

A technology of laser pulse deposition and pulsed light source, applied in the laser field, can solve the problems of small surface area, low film deposition rate, poor film uniformity, etc., and achieve the effect of improving uniformity, good anti-misalignment characteristics, and efficient processing

Active Publication Date: 2021-10-01
HUAZHONG UNIV OF SCI & TECH
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the defects of the prior art, the object of the present invention is to provide a laser pulse deposition system and processing method, aiming at solving the problem of small facets, poor film uniformity and low film deposition rate in the process of preparing thin films by current pulse laser deposition technology. lower question

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  • Laser pulse deposition system and processing method
  • Laser pulse deposition system and processing method

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Embodiment

[0043] Such as figure 1 As shown, a new type of laser pulse deposition system provided by the embodiment of the present invention includes a high repetition rate, low energy all-solid-state laser 1, a 45° mirror 2, a first motor and a guide rail 3 for moving the movable optical table 7, One-dimensional galvanometer 4, second motor 5 for driving galvanometer vibration, standard flat-field focusing lens 6, movable optical platform 7, incident window 8, vacuum cavity 9, target 10, substrate 11, diffractive optical element 12 , a collimating beam expander element 13, a rotating shaft 14, and a rotating shaft 15 with a motor.

[0044] The beam emitted by the all-solid-state laser 1 is collimated by the collimating beam expander unit 13 and then enters the diffractive optical element 12, modulated by the diffractive optical element 12 and then transmitted to the mirror 2, and the beam is reflected by the mirror 2 and then enters the one-dimensional vibrating mirror 4. Reflected by ...

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Abstract

The invention discloses a laser pulse deposition system and a processing method, and belongs to the technical field of laser. The system comprises a pulse light source, a scanning light path module and a vacuum deposition module which are connected in sequence; a light beam emitted by the pulse light source enters the scanning light path module, is focused by the scanning light path module and then obliquely enters the vacuum deposition module; the scanning light path module is used for keeping light spots at any position of the surface of a target material in the vacuum deposition module uniform in size; and in the scanning process of the focused light spots on the surface of the target material, the distance between a substrate and the target material is kept unchanged, and uniform light spot pulse deposition is achieved. According to the laser pulse deposition system and the processing method, pulse sputtering is performed on different areas of the surface of the target material by controlling the scanning light path module, so that efficient processing of a large-area and high-uniformity film is realized.

Description

technical field [0001] The invention belongs to the field of laser technology, and more specifically relates to a laser pulse deposition system and a processing method. Background technique [0002] Pulse Laser Deposition technology is currently one of the important technologies for preparing high-temperature superconducting, semiconductor, ferroelectric, diamond-like and ceramic films. control features. The main principle of the pulsed laser deposition technology is to focus the ultra-fast and ultra-intense pulsed laser generated by the pulsed laser on the surface of the target, so that the surface will generate high temperature and ablation instantly, and further generate high-temperature and high-pressure plasma. The plasma is directional and locally adiabatically expanded, emitted toward the substrate along the normal direction of the target surface, and deposited on the substrate to form a thin film. [0003] With the development of thin film industry technology, some...

Claims

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Application Information

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IPC IPC(8): C23C14/34C23C14/54
CPCC23C14/34C23C14/54
Inventor 秦应雄李晓
Owner HUAZHONG UNIV OF SCI & TECH
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