CT slip ring conductive disc forming method
A molding method and conductive plate technology, which is applied in the field of CT slip rings, can solve the problems affecting the use of CT slip ring conductive plates and the large size of CT slip ring conductive plates, so as to facilitate subsequent installation and use, improve coaxiality, and high quality Effect
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Embodiment 1
[0038] Embodiment 1: According to the above steps, the mass percentage of the casting material is: E44 epoxy resin 40%, methyltetrahydrophthalic anhydride 13%, polysebacic anhydride 13%, accelerator 0.7%, fumed silica 10%, the balance is hollow glass beads;
[0039] Wherein, 60% of the total mass of the above-mentioned fumed silica and hollow glass beads and 40% of the E44 epoxy resin are premixed to obtain the A component.
[0040] Wherein, 40% of the total mass of the above-mentioned fumed silica and hollow glass beads, methyltetrahydrophthalic anhydride, polysebacic anhydride, and an accelerator are premixed to obtain the B component.
[0041] Embodiment 2: According to the above steps, the mass percentage of the casting material is 36% of E44 epoxy resin, 9% of methyltetrahydrophthalic anhydride, 9% of polysebacic anhydride, 0.3% of accelerator, and 6% of fumed silica. %, the balance is hollow glass beads;
[0042] Wherein, 60% of the total mass of the above-mentioned fu...
Embodiment 3
[0044] Embodiment 3: According to the above steps, the mass percentage of the casting material is 44% of E44 epoxy resin, 17% of methyltetrahydrophthalic anhydride, 17% of polysebacic anhydride, 1.4% of accelerator, and 14% of fumed silica. %, the balance is hollow glass beads;
[0045] Wherein, 60% of the total mass of the above-mentioned fumed silica and hollow glass beads and 40% of the E44 epoxy resin are premixed to obtain the A component.
[0046]Wherein, 40% of the total mass of the above-mentioned fumed silica and hollow glass beads, methyltetrahydrophthalic anhydride, polysebacic anhydride, and an accelerator are premixed to obtain the B component.
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