Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

CT slip ring conductive disc forming method

A molding method and conductive plate technology, which is applied in the field of CT slip rings, can solve the problems affecting the use of CT slip ring conductive plates and the large size of CT slip ring conductive plates, so as to facilitate subsequent installation and use, improve coaxiality, and high quality Effect

Active Publication Date: 2021-10-08
杭州全盛机电科技有限公司
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the size of the conductive plate of the CT slip ring is relatively large, with a diameter of up to 1.5m. The current manufacturing process of the conductive plate on the market cannot well meet the preparation of the conductive plate with an outer diameter greater than 1m, which affects the conductivity of the CT slip ring to a certain extent. Disk usage

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • CT slip ring conductive disc forming method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Embodiment 1: According to the above steps, the mass percentage of the casting material is: E44 epoxy resin 40%, methyltetrahydrophthalic anhydride 13%, polysebacic anhydride 13%, accelerator 0.7%, fumed silica 10%, the balance is hollow glass beads;

[0039] Wherein, 60% of the total mass of the above-mentioned fumed silica and hollow glass beads and 40% of the E44 epoxy resin are premixed to obtain the A component.

[0040] Wherein, 40% of the total mass of the above-mentioned fumed silica and hollow glass beads, methyltetrahydrophthalic anhydride, polysebacic anhydride, and an accelerator are premixed to obtain the B component.

[0041] Embodiment 2: According to the above steps, the mass percentage of the casting material is 36% of E44 epoxy resin, 9% of methyltetrahydrophthalic anhydride, 9% of polysebacic anhydride, 0.3% of accelerator, and 6% of fumed silica. %, the balance is hollow glass beads;

[0042] Wherein, 60% of the total mass of the above-mentioned fu...

Embodiment 3

[0044] Embodiment 3: According to the above steps, the mass percentage of the casting material is 44% of E44 epoxy resin, 17% of methyltetrahydrophthalic anhydride, 17% of polysebacic anhydride, 1.4% of accelerator, and 14% of fumed silica. %, the balance is hollow glass beads;

[0045] Wherein, 60% of the total mass of the above-mentioned fumed silica and hollow glass beads and 40% of the E44 epoxy resin are premixed to obtain the A component.

[0046]Wherein, 40% of the total mass of the above-mentioned fumed silica and hollow glass beads, methyltetrahydrophthalic anhydride, polysebacic anhydride, and an accelerator are premixed to obtain the B component.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a CT slip ring conductive disc forming method. The method comprises the steps of (1) preparing a conductive disc mold; (2) turning a copper plate ring groove on an annular copper plate at one time, and putting the annular copper plate into the conductive disc mold; (3) preparing a pouring material; (4) dividing the material into a component A and a component B; (5) respectively adding the component A and the component B into static mixing vacuum pouring equipment to be heated, stirred and subjected to vacuum defoaming; (6) spraying a polytetrafluoroethylene coating on the inner surface of the conductive disc mold, smearing an organic silicon release agent, and heating the conductive disc mold and preserving heat in a constant-temperature hot air oven; (7) vacuumizing the air pressure in a mold cavity through a vacuum pump; (8) pouring the inside of the mold cavity through the static mixing vacuum pouring equipment; (9) after the pouring is completed, carrying out heating curing on the conductive disc mold, and after furnace cooling, carrying out demolding; and (10) integrally milling and forming after demolding. According to the CT slip ring conductive disc forming method, the batch production can be realized, and the produced conductive disc is high in coaxiality.

Description

technical field [0001] The invention relates to the technical field of a CT slip ring, in particular to a method for forming a conductive disk of a CT slip ring. Background technique [0002] Disc slip ring is a kind of electric rotary connector, which can realize the unrestricted and free rotation transmission of signal and power. To make up for the disadvantage that the existing conductive slip ring must be installed in the center of the rotating shaft, it can be widely used in large security inspection machines, medical CT and other equipment. [0003] The size of the conductive disk of the CT slip ring is large, and the diameter can reach 1.5m. The current conductive disk manufacturing process on the market cannot well meet the preparation of the conductive disk with an outer diameter greater than 1 m, which affects the conduction of the CT slip ring to a certain extent. use of the disk. [0004] It is particularly necessary to independently develop a CT slip ring cond...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B29C70/58B29C70/68B29C70/78B29C70/88B29B11/00C08K7/26C08K7/28C08L63/02
CPCB29C70/58B29C70/683B29C70/78B29C70/885C08K7/26C08K7/28C08L63/00
Inventor 李冰刘益清李琪
Owner 杭州全盛机电科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products