High-thermal-conductivity and low-expansion wrought aluminum alloy and preparation method thereof

Abstract

The invention belongs to the technical field of wrought aluminum alloys and discloses a high-thermal-conductivity and low-expansion wrought aluminum alloy and a preparation method thereof. The wrought aluminum alloy comprises the following components in percentage by mass: 1.5-2.5% of Fe, 1.0-2.0% of Ni, 0-0.5% of Yb, 0-0.5% of Mg and the balance of Al, wherein Yb and Mg are not 0 at the same time; the wrought aluminum alloy is obtained by performing mechanical vibration casting on a melt; or after mechanical vibration casting is completed, annealing treatment and rolling deformation treatment are carried out. The invention further discloses a preparation method of the wrought aluminum alloy. According to the high-thermal-conductivity and low-expansion wrought aluminum alloy and the preparation method thereof, Yb and/or Mg compound modification and vibration casting are used for improving the microstructure morphology of the alloy; and multi-target balance optimization of the heat-conducting property, the thermal expansion coefficient and the mechanical performance of the alloy is achieved. The wrought aluminum alloy has high thermal conductivity, low expansibility and high mechanical performance.

Description

technical field [0001] The invention relates to the technical field of deformed aluminum alloys, in particular to a deformed aluminum alloy with high thermal conductivity, low expansion and relatively high strength and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of large-scale integrated circuit technology, the field of electronic packaging has put forward higher requirements on the thermal conductivity and thermal expansion performance of the substrate. Due to the low thermal expansion coefficient of the chip, the thermal mismatch between the electronic device and the substrate is directly caused by the increase in temperature, resulting in an increase in thermal stress, which makes the device's working performance degrade sharply. Therefore, packaging materials are required to have high thermal conductivity and low thermal expansion coefficient to ensure efficient, safe and stable use of devices. At present, alum...

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Problems solved by technology

However, the Si element has a relatively great influence on the thermal conductivity of aluminum alloys, and the thermal conductivity of this alloy is difficult to meet the current requirements of high power consumption devices on the heat dissipation performance of packaging materials.

[0006] Some of the above-mentioned patented technologies involve aluminum-based composite materials, high thermal conductivity die-casting aluminum alloys, and high-silicon aluminum alloys. It is difficult for these alloys to simultaneously achieve a mutual balance between thermal conductivity, thermal expansion coefficient, and manufacturing cost, and cannot meet the needs of packaging in the context of current electronic devices. Material thermal conductivity and thermal expansion requirements limit the industrial application range of these alloys in high-power semiconductor devices

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