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Device and method for monitoring depth changes of groove of polishing pad

A groove depth and polishing pad technology, applied in the field of polishing pads, can solve the problem of inconvenient monitoring of changes in the groove depth of polishing pads, and achieve the effects of reducing product cost, personnel workload, and convenient monitoring.

Pending Publication Date: 2021-10-22
BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the present invention will solve the defect of inconvenient monitoring of the variation of the groove depth of the polishing pad in the prior art, thereby providing a device and method for monitoring the variation of the groove depth of the polishing pad

Method used

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  • Device and method for monitoring depth changes of groove of polishing pad
  • Device and method for monitoring depth changes of groove of polishing pad
  • Device and method for monitoring depth changes of groove of polishing pad

Examples

Experimental program
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Effect test

Embodiment 1

[0034] refer to figure 1 The present invention provides a device for monitoring the variation of the groove depth of a polishing pad, including a dresser 1, a dresser 2, a sensor 3, a monitoring system and an alarm system, the dresser 1 is used to connect to an external body; the dresser 2 is connected to the The dresser 1 is slidingly connected for dressing the polishing pad; the sensor 3 is connected with the dresser 1 for measuring the target distance between the sensor 3 and the dressing disc 2; the monitoring system is connected with the sensor 3 Electrically connected, used to receive the target distance, and compare the target distance with a preset threshold; the alarm system is electrically connected to the monitoring system, and used to send when the target distance is greater than the preset threshold Alarm information.

[0035] Through the above settings, when the operator needs to monitor the groove depth of the polishing pad, the dresser 1 is connected to the ex...

Embodiment 2

[0041] refer to Figure 2-3 , a kind of method for monitoring the variation of polishing pad groove depth provided by the present invention, comprises the following steps:

[0042] Step S100 , marking an initial target distance, wherein the initial target distance is the shortest linear distance from the sensor 3 to the conditioning disc 2 before the conditioning disc 2 abuts against the polishing pad and the polishing pad is dressed.

[0043] Through the above settings, there is a small gap in the thickness of different polishing pads, and a more accurate preset threshold can be obtained by marking the initial position, so that the change of the groove depth of the polishing pad is more accurately measured.

[0044] Step S200, acquiring a target distance, wherein the target distance is the shortest straight-line distance from the sensor 3 to the trimming disc 2;

[0045] Specifically, obtaining the target distance includes:

[0046] S201, calling the sensor 3 to obtain the ...

Embodiment 3

[0058] refer to Figure 4 , the embodiment of the present invention also provides a computer device, as shown in the figure, the device includes a processor 6 and a memory 7, wherein the processor 6 and the memory 7 can be connected through a bus 8 or other ways, in the figure, through a bus 8 connection as an example.

[0059] The processor 6 may be a central processing unit 6 (Central Processing Unit, CPU). Processor 6 can also be other general purpose processor 6, digital signal processor 6 (Digital Signal Processor, DSP), graphic processor 6 (Graphics Processing Unit, GPU), embedded neural network processor 6 (Neural-network Processing Unit, NPU) or other dedicated deep learning coprocessor 6, application specific integrated circuit (Application Specific Integrated Circuit, ASIC), field programmable gate array (Field-Programmable GateArray, FPGA) or other programmable logic devices, discrete gate or transistor logic devices , discrete hardware components and other chips,...

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Abstract

The invention relates to the technical field of polishing pads, in particular to a device and method for monitoring depth changes of a groove of a polishing pad. The device comprises a trimmer, a trimming disc, a sensor, a monitoring system and an alarm system, and the trimmer is used for being connected with an external machine body; the trimming disc is in sliding connection with the trimmer and is used for trimming the polishing pad; the sensor is connected with the trimmer and used for measuring the target distance between the sensor and the trimming disc; the monitoring system is electrically connected with the sensor and is used for receiving the target distance and comparing the target distance with a preset threshold value; and the alarm system is electrically connected with the monitoring system and is used for sending alarm information when the target distance is greater than the preset threshold value. The device and method can overcome the defect that the depth changes of the groove of the polishing pad are inconvenient to monitor in the prior art.

Description

technical field [0001] The invention relates to the technical field of polishing pads, in particular to a device and method for monitoring the depth variation of polishing pad grooves. Background technique [0002] In the semiconductor manufacturing process, chemical mechanical planarization (CMP) plays an extremely important role, and corresponding practitioners have higher and higher requirements for the process performance of equipment. The most critical factors in the process performance are the surface morphology of the wafer and the thickness of the removed film, which directly affect the subsequent process and determine the quality of the final chip. Polish is the main unit of CMP. Whether the surface roughness of the polishing pad (Pad) meets the standard and whether the remove rate (Remove rate) meets the process requirements are important considerations for the equipment. [0003] As the main part of grinding, the Pad in the Polish unit is used to modify the uneve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/34B24B49/12
CPCB24B37/34B24B49/12
Inventor 高跃昕崔凯
Owner BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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