Micromirror device and preparation method thereof
A micromirror, one-sided technology, applied in the field of optics, can solve the problems of small movement amplitude of electrostatic MEMS micromirrors, and achieve the effect of constant resonant frequency, large movement amplitude, and reduced stiffness coefficient
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[0081] The embodiment of the present application also discloses a preparation method of a micromirror device, comprising the following steps:
[0082] Obtaining an SOI wafer, the SOI wafer includes a substrate layer 110, a first buried layer 150 and a first device layer 120;
[0083] There are many ways to prepare and form the device layer structure, and three of them are introduced as examples below:
[0084] In the first possible implementation scheme, setting the movable structure on the first device layer 120 and the reinforcement frame 131 on the second device layer 130 includes the following steps:
[0085] The first device layer 120 is dry-etched by using a reduction process, that is, a load effect or a double layer etching process, to define a movable structure and an alignment mark; the movable structure includes a movable mirror 121, a driving plate 123 and Movable comb structure 122; prepare and form the weight-reducing portion 127 on the movable structure; obtain ...
Embodiment 1
[0109] The movable structure is arranged on the first device layer, and the reinforcement frame is arranged on the second device layer:
[0110] figure 1 It is a schematic structural diagram of a micromirror device according to an embodiment of the present application, figure 1 The micromirror device includes a substrate layer 110, a first buried layer 150 and a device structure layer, and the substrate layer 110, the first buried layer 150 and the device structure layer are sequentially stacked and connected from bottom to top;
[0111] The device structure layer includes a first device layer 120, a second buried layer 140 and a second device layer 130, and the first device layer 120, the second buried layer 140 and the second device layer 130 are sequentially stacked and connected from bottom to top;
[0112] A static comb structure 132 , an electrical isolation groove 133 and a second metal pad 134 are disposed on the second device layer 130 . The electrical isolation gro...
Embodiment 2
[0134] The movable structure is disposed on the first device layer 120, and the reinforcement frame 131 is formed on the movable structure by etching;
[0135] The difference from Example 1 is that, as Figure 7 As shown in (a), the reinforcement frame 131 is arranged on the first device layer 120, and the reinforcement frame 131 is formed on the movable structure by etching the first device layer 120; while realizing the reinforcement function, the overall quality of the movable structure is reduced .
[0136] Such as Figure 7 As shown in (b), the lower surface of the movable structure of the micromirror device is kept smooth and flat, and is coated with a metal film by metal evaporation or sputtering to form a metal reflection layer 160, the material is Ti / Au, and the thickness is 20-200nm between.
[0137] Different from Embodiment 1, the micromirror device in Embodiment 2 of the present application is fabricated by a double-layer resist etching process. Device layer s...
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Abstract
Description
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