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Temperature sensing device of integrated circuit

一种集成电路、温度感的技术，应用在测量装置、采用电装置、电路等方向，能够解决影响SOC等问题，达到架构简单、避免工艺负担、精准反应温度的效果

Active Publication Date: 2021-10-22
ITE TECH INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the electronic components inside the chip are very closely arranged, the heat generated by the operation of the electronic components will seriously affect the performance of the SOC, so it is very important to monitor the temperature change inside the SOC

Method used

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  • Temperature sensing device of integrated circuit
  • Temperature sensing device of integrated circuit
  • Temperature sensing device of integrated circuit

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Embodiment Construction

[0036] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.

[0037] figure 1 is a schematic diagram of a system-on-a-chip according to an embodiment of the present invention. Please refer to figure 1 , the SoC 100 includes at least one integrated circuit 102 and a temperature sensing device 104 . The integrated circuit 102 includes a plurality of metal wiring layers disposed on a substrate. These metal wire layers are stacked on the substrate, and are electrically connected in a vertical direction through a plurality of through holes. These metal wiring layers have wire patterns for providing interconnects for power supplies, transistors, capacitors or other electronic components of the integrated circuit 102 . In this embodiment, the temperatur...

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PUM

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Abstract

The invention provides a temperature sensing device of an integrated circuit. The integrated circuit includes a plurality of stacked metal wire layers, and the temperature sensing device includes a first metal sheet, a first via and a second via. The first metal sheet is disposed between the first metal wire layer and the second metal wire layer of the metal wire layers. The first via and the second via are used to connect the first metal sheet and the first metal wire layer, wherein a temperature sensing signal enters the first metal sheet through the first via and leaves the first metal sheet through the second via to measure the temperature of the integrated circuit.

Description

technical field [0001] The invention relates to a semiconductor technology, in particular to a temperature sensing device for an integrated circuit. Background technique [0002] With the advancement of process technology, the size of integrated circuits (Integrated Circuit, IC) is shrinking and shrinking, and the degree of integration is getting higher and higher. Until now, the industry has developed a System on a Chip (SOC) that integrates electronic systems on a single chip. However, since the electronic components inside the chip are very closely arranged, the heat generated during the operation of the electronic components will seriously affect the performance of the SOC. Therefore, it is very important to monitor the temperature change inside the SOC. Contents of the invention [0003] The invention provides a temperature sensing device for an integrated circuit, which has a simple structure and is easy to manufacture, and can accurately measure the internal temper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/34
CPCH01L22/34H01L23/5386G01K1/18G01K2219/00H01L23/34G01K7/01G01K7/20
Inventor 周宜群陈昱瑾黄子译
Owner ITE TECH INC
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