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Coating of copper-based surface intermetallic compound reinforced gradient high-entropy alloy and preparation method

A high-entropy alloy and surface metal technology, applied in the direction of metal material coating process, coating, etc., can solve the problems of complex and tedious overall process, high brittleness, insufficient coating toughness, etc., to save production cost, strengthen hardness, reduce The effect of ductile-brittle transition

Active Publication Date: 2021-10-29
ZHONGBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The intermetallic compound prepared by this method properly improves the compatibility with the substrate, but the overall process is complex and cumbersome, and the coating has insufficient toughness and high brittleness.

Method used

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  • Coating of copper-based surface intermetallic compound reinforced gradient high-entropy alloy and preparation method
  • Coating of copper-based surface intermetallic compound reinforced gradient high-entropy alloy and preparation method
  • Coating of copper-based surface intermetallic compound reinforced gradient high-entropy alloy and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] a formulated alloy powder, select CO, Cr, Fe, Ni, Al, Ti element powder to 1: 1: 1: 1: 1: X: Y (0 <x ≤ 1, 0 <y ≤ 1) atom is evenly uniform Mix; the purity of the metal powder is greater than 99.5%, the particle size is 100 ~ 300 mesh;

[0043] The B mixed powder is prepared by low energy ball milling. The specific step is: the powder mixed with powder is added to the ball mill, vacuum, and the ball mass ratio is 5: 1, the rotational speed is 150 r / min, the ball milling time is 2 h, will The powder is mixed; the ball mill is a vacuum stainless steel tank, and the ball is used as a stainless steel ball, and the ball mill is not added.

[0044] C is preprocessed on the surface of the T1 copper base. The specific step includes cleaning, drying, drying or sandblasting with # 400 and # 800, with anhydrous ethanol or acetone to clean the surface impurities and oil;

[0045] D From the surface of the matrix, the first sublayer is a CoCrfeni high entropy alloy powder, and the seco...

Embodiment 2

[0051] a formulated alloy powder, use CO, Cr, Fe, Ni, Al, Ti element powder to 1: 1: 1: 1: 1: 0.7: Y (0 <x ≤ 1, 0 <y≤1) atom is evenly uniform Mix; the purity of the metal powder is greater than 99.5%, the particle size is 100 ~ 300 mesh;

[0052] The B mixed powder is prepared by low energy ball milling. The specific step is: the powder mixed with powder is added to the ball mill, vacuum, and the ball mass ratio is 5: 1, the rotational speed is 150 r / min, the ball milling time is 2 h, will The powder is mixed; the ball mill is a vacuum stainless steel tank, and the ball is used as a stainless steel ball, and the ball mill is not added.

[0053] C is preprocessed on the surface of the T1 copper base. The specific step includes cleaning, drying, drying or sandblasting with # 400 and # 800, with anhydrous ethanol or acetone to clean the surface impurities and oil;

[0054] D From the surface of the substrate, the first sublayer is a CoCrfeni high entropy alloy powder, and the seco...

Embodiment 3

[0060] a formulated alloy powder, use CO, Cr, Fe, Ni, Al, Ti element powder to 1: 1: 1: 1: 1: 0.7: Y (0 <x ≤ 1, 0 <y≤1) atom is evenly uniform Mix; the purity of the metal powder is greater than 99.5%, the particle size is 100 ~ 300 mesh;

[0061] The B mixed powder is prepared by low energy ball milling. The specific step is: the powder mixed with powder is added to the ball mill, vacuum, and the ball mass ratio is 5: 1, the rotational speed is 150 r / min, the ball milling time is 2 h, will The powder is mixed; the ball mill is a vacuum stainless steel tank, and the ball is used as a stainless steel ball, and the ball mill is not added.

[0062] C is preprocessed on the surface of the T1 copper base. The specific step includes cleaning, drying, drying or sandblasting with # 400 and # 800, with anhydrous ethanol or acetone to clean the surface impurities and oil;

[0063] D From the surface of the substrate, the first sublayer is a CoCrfeni high entropy alloy powder, and the seco...

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Abstract

The invention belongs to the field of surface coating technologies and high-entropy alloys, and particularly relates to a coating of a copper-based surface intermetallic compound reinforced gradient high-entropy alloy and a preparation method. The high-entropy alloy is composed of Al, Co, Cr, Fe, Ni and Ti element powder, and is composed of a connecting layer, a transition layer and a reinforcing layer. The preparation method comprises the following steps that (1), gradient high-entropy alloy powder CoCrFeNi / CoCrFeNiAl<x>Ti<y> / CoCrFeNiAlTi is prepared, (x is more than 0 and less than or equal to 1, and y is more than 0 and less than or equal to 1); (2), pretreating is carried out on a matrix; and (3), the gradient high-entropy alloy coating is prepared on the copper surface through laser cladding by adopting the technological parameters that the laser power ranges from 3000 W to 3500 W, and the scanning speed ranges from 3 mm / s to 5 mm / s. The phase of a cladding layer is composed of a simple solid solution FCC phase, a simple solid solution BCC phase and an intermetallic compound TiCo<3>. According to the intermetallic compound reinforced gradient high-entropy alloy coating prepared through the method, it is guaranteed that good interface bonding between the cladding layer and a Cu matrix is ensured, the hardness and wear resistance of the cladding layer are greatly improved, and the method has a wide application prospect.

Description

Technical field [0001] The present invention belongs to the surface coating technology and the high entropy alloy field, and more particularly to the coating and preparation of a copper-based surface metal compound to strengthen the gradient high entropy alloy. Background technique [0002] Copper and copper alloys have excellent conductivity, thermally conductive corrosion resistance, and good quality characteristics. These excellent features make it widely used in the fields of electricity, electrician, military, machinery. However, copper and copper alloy have low hardness, low wear resistance, and normal damage caused by wear. Therefore, the abrasion resistance of copper and copper alloy limits its application range. [0003] The high entropy alloy (HEA) has been widely concerned by the Social Series since 1995 by China Taiwanese scholar Ye Jiki. Because of its high entropy effect, the lattice distortion effect is often easily formed. Thus high strength, high hardness, high r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/10
CPCC23C24/106Y02P10/25
Inventor 李晓峰冯英豪王帅仪登豪陈子健谢会起刘斌李忠华赵占勇王建宏李玉新王宇白培康
Owner ZHONGBEI UNIV
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