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Automatic capping machine for tin paste

A capping and automatic technology, applied in vibrating conveyor, capping machine safety/control, packaging, etc., can solve the problems of heavy barrel weight, low degree of automation, low packaging efficiency of bottled solder paste, etc. To achieve the effect of high packaging efficiency

Pending Publication Date: 2021-11-02
东莞市杰振机械设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Solder paste production goes through batching, mixing, grinding and dispersing, and then fills the solder paste through the filling machine, and then packs it into the material barrel. Now it mainly adopts the method of manual screw capping, and the filled solder paste material The barrel is sealed, but in the mass production process, the method of manually removing and screwing the cap is usually used, and the barrel containing the solder paste is heavy, it is not convenient to take, and the degree of automation is low. The packaging efficiency is extremely low, so it cannot meet the mass production packaging of solder paste bottles

Method used

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  • Automatic capping machine for tin paste
  • Automatic capping machine for tin paste
  • Automatic capping machine for tin paste

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] Such as Figure 1-11 As shown, the present invention provides an automatic solder paste capping machine, including a capping machine body, the capping machine body includes an automatic cap feeding device, an automatic capping device and an automatic capping device, and the capping machine body is also It includes a mechanical base 7 for installing the automatic capping device and automatic capping device, and a cap feeding mechanism cover 2 that wraps ...

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Abstract

The invention discloses an automatic capping machine for tin paste. The machine comprises a capping machine body, and the capping machine body comprises an automatic cap conveying device, an automatic capping device and an automatic cap screwing device. Meanwhile, the capping machine body further comprises a mechanical base used for installing the automatic capping device and the automatic cap screwing device and a cap conveying mechanism hood wrapping the automatic cap conveying device and a tin paste bottle is placed on a conveying belt to move in the axial direction. Meanwhile, when the tin paste bottle reaches a preset position and detected by a sensor, a rotating disc driving motor drives a separation rotating disc to rotate, the edge of the separation rotating disc is provided with an arc-shaped groove, the arc-shaped groove is attached to the tin paste bottle, and the separation rotating disc blocks a next tin paste bottle; and automatic tin paste bottle packaging is achieved through a transmission mechanism and the arrangement of a first capping mechanism, a second capping mechanism and a cap screwing mechanism in a matched mode, manual operation is not needed in the whole process, and the tin paste bottle packaging efficiency is high.

Description

technical field [0001] The invention relates to the technical field of bottled solder paste packaging, in particular to an automatic solder paste capping machine. Background technique [0002] Solder paste production goes through batching, mixing, grinding and dispersing, and then fills the solder paste through the filling machine, and then packs it into the material barrel. Now it mainly adopts the method of manual screw capping, and the filled solder paste material The barrel is sealed, but in the mass production process, the method of manually removing and screwing the cap is usually used, and the barrel containing the solder paste is heavy, it is not convenient to take, and the degree of automation is low. The packaging efficiency is extremely low, so it cannot meet the mass production packaging of solder paste bottles. Contents of the invention [0003] In order to overcome the shortcomings of the prior art solutions, the present invention provides an automatic solde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B7/28B65G27/16B65G43/08B65G47/82B65G47/88B67B3/20B67B3/26
CPCB65B7/2807B65B7/2835B67B3/204B67B3/26B65G43/08B65G47/8823B65G27/16B65G47/82B65G2203/0233B65G2201/0244
Inventor 邓有杰
Owner 东莞市杰振机械设备有限公司
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