Resistance paste for high-stability thick-film resistor

A technology of resistance paste and thick film resistors, which is applied in thick film resistors, resistors, resistor manufacturing, etc., can solve the problems of low power resistance, low technical performance and reliability of resistance paste, and achieve improved thermal conductivity, The effect of high resistance stability and simple preparation process

Active Publication Date: 2021-11-12
西安宏星电子浆料科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In order to meet the market demand, it is urgent to develop a resistor paste for high-stability thick-film resistors, which can solve the problems of low tec

Method used

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  • Resistance paste for high-stability thick-film resistor
  • Resistance paste for high-stability thick-film resistor
  • Resistance paste for high-stability thick-film resistor

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Embodiment

[0017] Preparation of glass powder: according to the mass percentage, the composition is PbO 44%, Al 2 o 3 19%, B 2 o 3 15%, SiO 2 22% to prepare glass powder G-1, composed of PbO 60%, SiO 2 17%, B 2 o 3 12%, Al 2 o 3 11% to prepare glass powder G-2. The specific preparation method is: after mixing various oxides evenly, put them in a melting furnace at 1400 ° C for 1.5 hours, and the obtained glass solution is water-quenched and broken into glass slag, and the glass The slag is ground into a particle size of 1.0-1.3 μm by a ball mill, and dried to obtain glass powder G-1 and G-2.

[0018] Preparation of modified glass powder: select polycrystalline diamond powder with a particle size of 1-5 μm prepared by carbon black through directional blasting method, mix uniformly with glass powder G-1 according to the ratio in Table 1, and granulate, then heat In the isostatic pressing process, pressurize and hold at 150MPa and different temperatures for 1h, or at normal pre...

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Abstract

The invention discloses resistance paste for a high-stability thick-film resistor. The resistance paste comprises the following components in percentage by mass: 15-40% of conductive powder, 25-45% of modified glass powder, 1-5% of an inorganic additive and 25-35% of an organic carrier. According to the invention, noble metal powder in the conductive powder is one or more selected from silver, palladium, silver-palladium alloy powder and ruthenium dioxide; and the modified glass powder is powder with a particle size of 0.5-2 [mu]m and is prepared by mixing polycrystalline diamond powder with a particle size of 1-5 [mu], which is prepared from carbon black or graphite through a directional blasting method, with glass powder, conducting granulating and then performing treatment via a hot isostatic pressing process. The resistance paste is used for the thick-film resistor and has the advantages of high voltage resistance, large current resistance and good resistance stability.

Description

technical field [0001] The invention belongs to the technical field of resistance paste, in particular to a resistance paste for high-stability thick-film resistance. Background technique [0002] Thick film resistor paste is a technology-intensive product integrating metallurgy, chemistry, materials, electronic technology, analysis and testing technology and other multi-disciplinary fields. In order to adapt to printing, sintering process requirements and practical application requirements, it must have printability, functional characteristics and process compatibility. The commonly used resistance paste is a kind of paste made by mixing functional phase, binder phase, additives and organic vehicle in a certain proportion. [0003] Thick film resistor paste is one of the basic raw materials for the production of various thick film integrated circuits, thick film resistors, and resistors. Thick-film integrated circuits, thick-film resistors, and resistors are mainly used i...

Claims

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Application Information

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IPC IPC(8): H01C7/00H01C17/065H01B1/16H01B1/18H01B1/22H01B1/24C03C12/00
CPCH01C7/003H01C17/0652H01C17/06526H01C17/06513H01B1/16H01B1/22H01B1/18H01B1/24C03C12/00
Inventor 赵莹鹿宁赵科良孙社稷何依青王妮刘瑶赵敏张艳萍
Owner 西安宏星电子浆料科技股份有限公司
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