Regeneration process for dry etching lower electrode of LCD and AMOLED

Abstract

The invention discloses a regeneration process for a dry etching lower electrode of an LCD and an AMOLED. The regeneration process comprises the following steps of S11, detaching an electrode needing to be regenerated from dry etching equipment; S12, removing the surface layer part of an original ceramic coating on the surface of the electrode; S13, shielding the back surface and the side surface of the electrode by using a shielding material; S14, performing sand blasting on the surface of the electrode; S15, coating the surface of the electrode with the ceramic coating by using a thermal spraying method; S16, after spraying is completed, removing the shielding material in the step S13; S17, performing hole sealing on the sprayed ceramic coating; S18, machining the surface of the electrode, so that a protrusion is formed on the periphery of the surface of the electrode; and S19, reassembling the electrode and the dry etching equipment. According to the regeneration process for the dry etching lower electrode of the LCD and the AMOLED provided by the invention, the insulating property, compactness, hardness and other properties of the surface ceramic layer are consistent with those of a new product, the service life of the regenerated dry-etching lower electrode can be prolonged to about 6 months, and the dry-etching lower electrode can be regenerated repeatedly, so that the frequency of purchasing a new product electrode by a panel manufacturer can be remarkably reduced, and the cost of the dry-etching lower electrode can be reduced.

Description

technical field [0001] The invention relates to a regeneration process for electrodes, in particular to a regeneration process for dry etching lower electrodes of LCDs and AMOLEDs. Background technique [0002] In the production process of LCD and AMOLED panels, one of the core processes is dry etching. During dry etching, the glass substrate will be placed on the lower electrode, and then the halide gas will be passed into the dry etching equipment, and the plasma will be formed between the lower electrode and the upper electrode through the electromagnetic field to form a thin film layer on the glass substrate. Etch out the desired microstructure. [0003] In the above dry etching process, due to the high corrosiveness of the halide gas and the high chemical activity of the plasma formed by it, the lower electrode will be continuously eroded, and the etched material on the glass substrate will also be deposited on the lower part. Therefore, the surface performance of the...

AI Technical Summary

Problems solved by technology

However, the processing technology of the lower electrode is complex and requires high precision. At present, several companies in Japan and South Korea monopolize the technology, so it is a huge cost burden for panel manufacturers to constantly replace new electrodes.

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