Polyimide waterborne epoxy coating and preparation method thereof
A polyimide water-based and epoxy coating technology, used in the coating field, can solve the problems of limited types of water-based epoxy resin coating resins and poor performance, and achieve improved anti-floating and blooming properties, strong water resistance, and improved performance. The effect of water resistance
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Embodiment 1
[0039] Prepare polyimide aqueous epoxy resin, the method is as follows:
[0040] (1) Add 1 mol of 1-amino-3-chloro-2-propanol hydrochloric acid and 1 mol of chlorosuccinic acid into NaOH aqueous solution (sodium hydroxide concentration 0.5 mol / L, dosage 1 L), stir and react at room temperature for 1 h, Solution I was prepared.
[0041] (2) Add 1 mol of disodium ethylene glycol and 1 mol of 3,5-dichlorobenzenesulfonic acid into NaOH aqueous solution (sodium hydroxide concentration 0.5 mol / L, dosage 1 L), stir and react at room temperature for 0.5 h to obtain Solution II.
[0042] (3) The solution I, the solution II and 1 mol of 3-chloro-5-epoxymethylbenzenesulfonic acid were mixed and stirred for 3 hours to prepare a polyimide water-based epoxy resin.
Embodiment 2
[0044] Prepare polyimide aqueous epoxy resin, the method is as follows:
[0045] (1) Add 1 mol of 1-amino-3-chloro-2-propanol hydrochloric acid and 1 mol of chlorosuccinic acid into NaOH aqueous solution (sodium hydroxide concentration 0.5 mol / L, dosage 1 L), stir and react at 40°C for 1 h , to prepare solution I.
[0046] (2) Add 20 mol of disodium ethylene glycol and 20 mol of 3,5-dichlorobenzenesulfonic acid into NaOH aqueous solution (sodium hydroxide concentration 0.5 mol / L, dosage 20 L), stir and react at 40°C for 0.5 h to prepare Solution II was obtained.
[0047] (3) Mix solution I, solution II with 1 mol of 3-chloro-5-epoxymethylbenzenesulfonic acid, stir and react at 40° C. for 3 hours to prepare a polyimide water-based epoxy resin.
Embodiment 3
[0049] A kind of polyimide water-based epoxy coating, comprises the component of following mass percentage: 50 parts of polyimide water-based epoxy resins of bisphenol A type epoxy resin, embodiment 1 preparation, 0.5 part of ethylenediamines , 1 part of Lewis acid, 1 part of BYK-3101, 0.1 part of sodium oleate, 1 part of GPE type defoamer, 5 parts of titanium dioxide, 8 parts of molybdenum chrome orange, 20 parts of calcium carbonate, 30 parts of mica powder, and 50 parts of water.
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