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Formation method of semiconductor structure

A semiconductor and functional structure technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems affecting the electrical properties of transistors, achieve the effects of reducing recombination and dissociation, reducing trap defects, and reducing low-frequency noise

Pending Publication Date: 2021-11-26
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Abstract
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  • Application Information

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Problems solved by technology

[0004] However, existing transistors suffer from severe low-frequency noise, which affects the electrical performance of the transistor

Method used

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  • Formation method of semiconductor structure
  • Formation method of semiconductor structure

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Embodiment Construction

[0028] There are many problems in the semiconductor forming method, for example, the low-frequency noise of the formed semiconductor structure is serious.

[0029] It has been found through research that there are trap defects such as holes or dangling bonds on the surface of the gate dielectric layer of transistors (especially the high-k dielectric layer of oxygen-containing high-k-metal gate transistors), resulting in charged ions (mainly oxygen ions), which are easy to communicate with The trap defects on the surface of the gate dielectric layer recombine and decompose, and the charged ions recombine and decompose repeatedly with the trap defects on the surface of the gate dielectric layer to generate low-frequency electrical signals. This low-frequency noise signal will seriously affect the performance of the transistor.

[0030] A method for reducing low-frequency noise includes: after forming a gate dielectric layer, performing surface passivation treatment on the gate di...

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Abstract

The embodiment of the invention provides a formation method of a semiconductor structure. The formation method comprises the following steps that: a substrate is provided; a gate function structure is formed on the substrate, wherein the gate function structure comprises a gate function layer or a plurality of gate function layers, the step of forming the gate function layer further comprises the following steps of forming a function material layer on the substrate, performing de-compounding treatment on the surface of the functional material layer to reduce charged ions captured by trap defects on the surface of the gate functional material layer, after the de-compounding treatment, passivating the surface of the gate function material layer to reduce trap defects on the surface of the gate function material layer; and a grid electrode is formed on the grid function structure. The de-compounding treatment and the passivating treatment can reduce the low-frequency noise of the formed semiconductor structure.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for forming a semiconductor structure. Background technique [0002] As the integration level of semiconductor devices increases, the critical dimensions of transistors continue to shrink. However, as the size of the transistor decreases sharply, the thickness of the gate dielectric layer and the operating voltage cannot be changed accordingly, which makes it more difficult to suppress the short channel effect and increases the channel leakage current of the transistor. [0003] In order to adapt to the shrinking of transistor volume, high-k-metal gate transistors emerged as the times require. The high-k gate functional layer can increase the physical thickness of the gate dielectric layer while keeping the gate capacitance unchanged, so as to achieve the dual purposes of reducing gate leakage current and improving device reliability. [0004] Howev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/28H01L21/336
CPCH01L21/28008H01L29/66477H01L29/66795
Inventor 张海洋涂武涛陈建
Owner SEMICON MFG INT (SHANGHAI) CORP
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