Small deep hole inner wall ultrasonic vibration machining cutter and a preparation method thereof

An ultrasonic vibration and tool processing technology, applied in metal processing equipment, manufacturing tools, drilling/drilling equipment, etc., can solve the problems of easy wear, tool friction heat generation and poor cooling effect, etc., to increase the chip space, The effect of improving tool strength, improving machining stability and service life

Active Publication Date: 2021-12-03
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is: in order to solve the above-mentioned technical problem of easy wear of the tool due to frictional heat generation and poor cooling effect in the process of high-frequency ultrasonic vibration machining of the inner wall of the deep small hole, the present invention provides a tool for ultrasonic vibration machining of the inner wall of the deep small hole and its preparation method

Method used

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  • Small deep hole inner wall ultrasonic vibration machining cutter and a preparation method thereof
  • Small deep hole inner wall ultrasonic vibration machining cutter and a preparation method thereof
  • Small deep hole inner wall ultrasonic vibration machining cutter and a preparation method thereof

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Effect test

Embodiment 1

[0031] Such as Figure 1-3 As shown, this embodiment provides a tool for ultrasonic vibration machining of the inner wall of a deep small hole, including a handle 1 and a base 2 of the tool, the handle 1 and the base 2 of the tool are an integral cylindrical connection body of different diameters, the The diameter of the tool base 2 is greater than the diameter of the handle 1, the tool base 2 is coated with a CVD diamond coating 3, the thickness of the CVD diamond coating 3 is 150 μm, and the diamond abrasive grains on the surface of the CVD diamond coating 3 The size is 0.5-10 μm, the CVD diamond coating 3 is provided with a spiral groove 4, the width of the spiral groove 4 is 300 μm, and the depth is more than 20 μm, and the cross section of the spiral groove 4 is rectangular , the pitch of the helical groove 4 is 1 mm, the angle between the helical groove 4 and the end face of the tool base 2 is 45°, and the material of the tool handle 1 and the tool base 2 is SiC; The di...

Embodiment 2

[0037] like Figure 1-3 As shown, this embodiment provides a tool for ultrasonic vibration machining of the inner wall of a deep small hole, including a handle 1 and a base 2 of the tool, the handle 1 and the base 2 of the tool are an integral cylindrical connection body of different diameters, the The diameter of the tool substrate 2 is greater than the diameter of the handle 1, the tool substrate 2 is coated with a CVD diamond coating 3, the thickness of the CVD diamond coating 3 is 100 μm, and the diamond abrasive grains on the surface of the CVD diamond coating 3 The size is 0.5-10 μm, the CVD diamond coating 3 is provided with a helical groove 4, the width of the helical groove 4 is 200 μm, and the depth is 20 μm or more, and the cross section of the helical groove 4 is rectangle, the pitch of the spiral groove 4 is 0.5 mm, the angle between the spiral groove 4 and the end surface of the tool base 2 is 30°, and the material of the handle 1 and the tool base 2 are both Si...

Embodiment 3

[0043] like Figure 1-3 As shown, this embodiment provides a tool for ultrasonic vibration machining of the inner wall of a deep small hole, including a handle 1 and a base 2 of the tool, the handle 1 and the base 2 of the tool are an integral cylindrical connection body of different diameters, the The diameter of the tool base 2 is greater than the diameter of the handle 1, the tool base 2 is coated with a CVD diamond coating 3, the thickness of the CVD diamond coating 3 is 50 μm, and the diamond abrasive grains on the surface of the CVD diamond coating 3 The size is 0.5-10 μm, the CVD diamond coating 3 is provided with a helical groove 4, the width of the helical groove 4 is 150 μm, and the depth is 20 μm or more, and the cross section of the helical groove 4 is rectangular, the pitch of the spiral groove 4 is 1.5mm, the angle between the spiral groove 4 and the end surface of the tool base 2 is 60°, and the material of the tool handle 1 and the tool base 2 are both SiC; th...

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Abstract

The invention discloses a small deep hole inner wall ultrasonic vibration machining cutter and a preparation method thereof, and belongs to the technical field of small deep hole inner wall machining. The tool and the method solve the technical problem that in the small deep hole inner wall high-frequency ultrasonic vibration machining process, a cutter is prone to abrasion due to the fact that heat is generated by friction and the cooling effect is poor. A cutter handle and a cutter base are integrated cylindrical connectors with different diameters, the cutter base is coated with a CVD diamond coating, a spiral groove is formed in the CVD diamond coating, and the cutter handle and the cutter base are both made of SiC. The CVD diamond coating on the surface of the cutter has higher abrasive particle density and does not contain any binding agent, so that the cutter has higher hardness and better wear resistance; and the spiral groove increases a chip containing space and can effectively improve the grinding performance and the chip removal and heat removal capacity, the machining stability of the cutter is improved, the service life of the cutter is prolonged, and high-efficiency, high-precision and high-quality ultrasonic vibration machining of the inner wall of a micro hole is achieved.

Description

technical field [0001] The invention relates to the technical field of mechanical processing, and more specifically relates to the technical field of deep and small hole inner wall processing. Background technique [0002] The deep and small hole structure (hole diameter 0.5mm-3mm, depth-to-diameter ratio > 3) is widely used in many engineering fields, such as diagnostic holes for inertial confinement fusion (ICF) target parts, engine fuel nozzles, and cooling holes for aeroengine blades. The machining accuracy and quality of small holes often determine the performance of its parts, so the demand for ultra-precision machining of deep and small holes is becoming more and more urgent. At present, the processing of deep and small holes mainly adopts precision drilling or laser drilling technology. The deep and small holes processed by the above methods often have serious defects on the inner wall surface along with processing, such as cracks, burrs, pits, recast layers, etc....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23B51/00B23P15/28
CPCB23B51/00B23P15/28Y02E30/10
Inventor 张春雨刘晗张海军李国赵清亮郭兵高林梁榉曦
Owner LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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