Magnetorheological elastomer as well as preparation method and application thereof

Abstract

The invention discloses a magnetorheological elastomer as well as a preparation method and application thereof. The magnetorheological elastomer comprises the following components of, in parts by weight, 30-70 parts of a polyurethane prepolymer, 30-60 parts of magnetic particles, 2-20 parts of abrasive particles, 2-5 parts of a foaming agent, 3-6 parts of a plasticizer, 1-6 parts of a chain extension cross-linking agent and 0.03-0.07 part of a catalyst, and the magnetic particles are carbonyl iron powder and/or ferroferric oxide. According to the magnetorheological elastomer, the magnetic particles serve as carriers, a magnetic chain string consistent with a magnetic field line in direction is formed under the action of a directional magnetic field in the pre-structuring process, an abrasive material, a foaming agent and other substances are clamped in the magnetic chain string, and after vulcanization, the magnetorheological elastomer with the magnetic particles, the abrasive particles and air holes in directional arrangement and capable of being subjected to a solid-phase Fenton reaction is finally formed; and the magnetorheological elastomer can be applied to grinding and polishing of hard and brittle photoelectric materials, the machining efficiency is effectively improved, coarse polishing and fine polishing can be synchronously achieved, and a high-quality machined surface is obtained.

Description

technical field [0001] The invention relates to the technical field of ultra-precision polishing, and more specifically, relates to a magnetorheological elastomer and its preparation method and application. Background technique [0002] The performance and manufacturing cost of hard and brittle optoelectronic materials SiC-based devices are important factors restricting the development of microelectronics, optoelectronics and other industries, and the performance of devices is closely related to the surface processing quality of SiC single crystal substrates. Therefore, how to ensure the quality of processed substrates? It is an important subject to realize the ultra-smooth, defect-free, and damage-free high-quality processing surface on the chip surface. [0003] At present, chemical mechanical polishing (CMP) is an effective and commonly used method to achieve ultra-precision machining of hard and brittle materials. It is generally the last process in the processing of har...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to overcome the existing flaws and deficiencies that the use of magnetorheological elastomers to polish hard and brittle optoelectronic materials easily causes subsurface damage on the surface of the material and cannot realize ultra-precision grinding and polishing of the material surface, and provides a A magnetorheological elastomer, the magnetor...

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