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Tube core structure for high-efficiency power tube

A power tube and high-efficiency technology, which is applied in the field of microwave power devices, can solve the problems of large inductance value error, difficulty in mass production, and increased circuit area, so as to reduce the overlap of current waveforms, high manufacturing accuracy, and improve work efficiency. efficiency effect

Pending Publication Date: 2021-12-10
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The inductance is realized by bonding gold wires. The microstrip line is basically made of high-order ceramics. The capacitive element is a MIM capacitor. However, this method realizes a large error in the inductance value by bonding gold wires. error, which will affect the effect of harmonic suppression, which is not conducive to the improvement of the efficiency of power devices, and is difficult to apply to mass production. At the same time, this method will increase the area of ​​the circuit, which is not conducive to the miniaturization of power devices

Method used

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  • Tube core structure for high-efficiency power tube
  • Tube core structure for high-efficiency power tube
  • Tube core structure for high-efficiency power tube

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Embodiment 1

[0019] Below in conjunction with accompanying drawing, technical scheme of the present invention is further described

[0020] A tube core structure for high-efficiency power tubes, the internal structure schematic diagram is as follows figure 1 As shown, the die is composed of multiple units connected in parallel, and the gate terminal of each unit cell in the die is connected in parallel through an inductance L and a capacitor C in series to form a harmonic control network. The inductance and the gate of the die Connected, the capacitor is connected to ground, as figure 2 shown. Then, according to the requirements of the actual working frequency band of the die, determine the appropriate inductance and capacitance values, so that the resonant frequency of the harmonic network formed by it is at the second or multiple harmonic frequencies of the actual working frequency band, and based on the same substrate material, the design On-chip inductors and capacitors. Finally, th...

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Abstract

The invention relates to a tube core structure for a high-efficiency power tube. According to the tube core design provided by the invention, a harmonic control network formed by connecting an inductor and a capacitor in series and then connecting the inductor and the capacitor in parallel to the ground is introduced at a grid position, so that resonance is formed at secondary or multiple harmonic frequencies of a working frequency band, and voltage and current waveforms when the tube core works are controlled, and the overlapping part of the two parts is reduced; therefore, the power consumption of the tube core during working is reduced, and the working efficiency of the power tube is further improved. The efficiency of the power amplifier is greatly improved on the basis of ensuring the output power, and the power amplifier has wide application prospects in the fields of satellite communication, radar, aerospace and the like.

Description

technical field [0001] The invention relates to a tube core structure for a high-efficiency power tube, belonging to the technical field of microwave power devices. Background technique [0002] With the rapid development of wireless communication technology, the demand for high-power and high-efficiency microwave power amplifiers in communication satellites, ground base stations, radar, aerospace and other fields is increasing. Power amplifiers are mostly packaged in the form of external matching and internal matching. The power amplifier packaged in the form of external matching is large in size, and the output power of hundreds of watts is easier to achieve. The power amplifier packaged in the form of internal matching, the die, matching circuit, power divider, etc. The modules are sintered in the shell, and the modules are connected with gold wire bonding wires. The power amplifier using the internal matching process also has the advantages of high power and small size. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03F3/195H03F3/213H03F1/02
CPCH03F3/195H03F3/213H03F1/02
Inventor 顾黎明唐世军杨宝金黄丹王帅汤茗凯
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD