Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Resistance paste with low temperature coefficient

A low temperature coefficient, resistance paste technology, applied in the direction of resistors, resistance manufacturing, circuits, etc., can solve the problems of large changes in the resistance value of resistors, the inability to apply high-precision resistors, and large differences in the temperature coefficient of resistance. Achieve the effect of small positive and negative temperature coefficient difference, meet product performance requirements, and solve large temperature coefficient

Active Publication Date: 2021-12-14
西安宏星电子浆料科技股份有限公司
View PDF11 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Existing thick film resistor pastes are applied to resistors. The resistance value of the resistor will change with the change of temperature, which is generally called the temperature coefficient of resistance. Because the temperature coefficient of resistance is too large or in the process of high and low temperature , the value of the temperature coefficient of resistance varies greatly, which will cause a large change in the resistance value of the resistor product, and cannot be applied to high-precision resistors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resistance paste with low temperature coefficient
  • Resistance paste with low temperature coefficient
  • Resistance paste with low temperature coefficient

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments, it does not play a role in defining the scope of the present invention. The scope of the present invention is defined only by the claims, any omitted skilled artisan on the basis of the disclosed embodiment of the present invention made, substitutions or modifications are intended to fall within the scope of the present invention.

[0015] 1, selected conductive powder: specific surface area of ​​ruthenium dioxide 25 ~ 55m 2 / G, a specific surface area of ​​lead ruthenate 3 ~ 10m 2 / g.

[0016] Preparation of 2, a lead borosilicate glass frit: a mass percentage PbO 65%, SiO 2 3%, CaCO 3 9%, Al 2 O 3 3%, B 2 O 3 After 15%, ZnO 5% starting material was weighed, various raw materials were mixed uniformly, the resulting mixture was placed in a melting furnace for melting 1050 deg.] C, holding time 2h, the resulting solution was subjected to water quenching gl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
specific surface areaaaaaaaaaaa
specific surface areaaaaaaaaaaa
Login to View More

Abstract

The invention discloses a resistance paste with low temperature coefficient, and 100% of the resistance paste is prepared from the following components in percentage by mass: 20 -35 percent of conductive powder, 25-45 percent of glass binding phase, 1-5 percent of additive and 30-45 percent of organic carrier, wherein the conductive powder is at least one of ruthenium dioxide and lead ruthenate, and the glass binding phase is celsian composite lead borosilicate glass which is prepared by carrying out heat preservation on lead borosilicate glass powder and celsian in a muffle furnace at 450-500 DEG C for 24 hours and then carrying out ball milling until the particle size is 0.7-1.3 microns. The lead borosilicate glass powder is modified by using celsian, and the temperature coefficient property of a resistor is adjusted, so that the resistance paste has the advantages of small positive and negative temperature coefficient difference, and the use requirement of a high-precision resistor product can be met.

Description

technical field [0001] The invention belongs to the technical field of resistance paste, and in particular relates to a resistance paste applied to high-precision resistors with small temperature coefficient and small difference between positive and negative temperature coefficients. Background technique [0002] Thick film resistor paste is a technology-intensive product integrating metallurgy, chemistry, materials, electronic technology, analysis and testing technology and other multi-disciplinary fields. In order to adapt to printing, sintering process requirements and practical application requirements, it must have printability, functional characteristics and process compatibility. The commonly used resistance paste is a kind of paste composed of functional phase, binder phase, additives and organic vehicle, mixed in a certain proportion. [0003] Thick-film resistor paste is used as the raw material for the production of various resistors, and the paste is required to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/14H01B1/20H01B1/06H01B1/08H01C17/065C03C12/00
CPCH01B1/14H01B1/20H01B1/08H01B1/06H01C17/06533H01C17/06513C03C12/00
Inventor 鹿宁吴高鹏高振威马倩张建益兰金鹏
Owner 西安宏星电子浆料科技股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products