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Epoxy resin composite Sn-Ag-Cu lead-free soldering paste

A technology of epoxy resin and lead-free solder paste, applied in welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of easy segregation, difficult control of nano or micro particles, and complicated preparation process of particle enhancement method. , to achieve the effect of improving wetting and spreading performance, improving shear strength and reliability

Active Publication Date: 2021-12-31
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, each of the above approaches has pros and cons
The alloying method prolongs the solder smelting process, which leads to an increase in production cost and the burning loss and segregation of trace alloy elements are difficult to control; the preparation process of the particle reinforcement method is complicated, and nano or micro particles are easy to segregate; low-temperature composite solder paste, composite Sn- Although the comprehensive properties of Bi lead-free solder paste and other composite solders have been significantly improved, their solder joint reliability and other properties still cannot meet the growing and rapidly developing needs of new electronic product manufacturing.

Method used

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  • Epoxy resin composite Sn-Ag-Cu lead-free soldering paste
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Experimental program
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Effect test

Embodiment 1

[0026] An epoxy resin composite Sn-Ag-Cu lead-free solder paste is characterized in that its composition is a mixture of 3% epoxy resin, curing agent and accelerator (each component accounts for 3% of the composition by mass percentage). The mass percentage ratio is epoxy resin: curing agent: accelerator = 100: 70: 3), 0.005% nanometer Ga 2 o 3 with CeO 2 Composed mixture, the balance is commercially available Sn-Ag-Cu solder paste (specifically EcoAPP-X1 solder paste).

[0027] The epoxy resin is E51 type bisphenol A, the curing agent is methyltetrahydrophthalic anhydride (MTHPA), the accelerator is 2,4,6-tris(dimethylaminomethyl)phenol (ie DMP-30), nanometer Ga 2 o 3 with CeO 2 The mixture consists of 40% nano Ga 2 o 3 Powder with 60% Nano CeO 2 Powder composition, the total addition amount is 0.005%. Used commercially available Sn-Ag-Cu solder paste, wherein Sn-Ag-Cu alloy powder accounts for commercially available Sn-Ag-Cu solder paste by 85% by mass percentage, an...

Embodiment 2

[0032] An epoxy resin composite Sn-Ag-Cu lead-free solder paste is characterized in that its composition is a mixture of 5% epoxy resin, curing agent and accelerator (each component accounts for 5% of the composition by mass percentage). The mass percentage ratio is epoxy resin: curing agent: accelerator = 100: 90: 10), 0.01% nanometer Ga 2 o 3 with CeO 2 Composed mixture, the balance is commercially available Sn-Ag-Cu solder paste (specifically EcoAPP-X1 solder paste).

[0033] The epoxy resin is E44 type bisphenol A, the curing agent is maleic anhydride, the accelerator is catechol, nanometer Ga 2 o 3 with CeO 2 mixture consisting of 40% nano Ga 2 o 3 Powder with 60% Nano CeO 2 Powder composition, the total addition amount is 0.01%. Used commercially available Sn-Ag-Cu solder paste, wherein Sn-Ag-Cu alloy powder accounts for 95% of commercially available Sn-Ag-Cu solder paste by mass percentage, and the balance is commercially available flux (specifically ECO Flux 8...

Embodiment 3

[0038] An epoxy resin composite Sn-Ag-Cu lead-free solder paste is characterized in that its composition is a mixture of 7% epoxy resin, curing agent and accelerator (each component accounts for 7% of the composition by mass percentage). The mass percentage ratio is epoxy resin: curing agent: accelerator = 100: 80: 7), 0.008% nanometer Ga 2 o 3 with CeO 2 Composed mixture, the balance is commercially available Sn-Ag-Cu solder paste (specifically EcoAPP-X1 solder paste).

[0039] The epoxy resin is a mixture of 50% E44 type bisphenol A + 50% E51 type bisphenol A, and the curing agent is 30% methyltetrahydrophthalic anhydride (MTHPA) + 30% maleic anhydride + 40% phthalein A mixture of acid anhydrides, the accelerator is a mixture of 40% 2,4,6-tris(dimethylaminomethyl)phenol (ie DMP-30) + 30% catechol + 30% resorcinol, nano Ga 2 o 3 with CeO 2 mixture consisting of 40% nano Ga 2 o 3 Powder with 60% Nano CeO 2Powder composition, the total amount added is 0.008%. Used com...

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Abstract

The invention discloses epoxy resin composite Sn-Ag-Cu lead-free soldering paste, and belongs to brazing materials in the field of metal materials and metallurgy. The epoxy resin composite Sn-Ag-Cu lead-free soldering paste is characterized by comprising the following components in percentage by mass: 3%-7% of a mixture consisting of epoxy resin, a curing agent and an accelerant, 0.005%-0.01% of a mixture consisting of nano Ga2O3 and CeO2, and the balance commercially-available Sn-Ag-Cu solder paste. The composite Sn-Ag-Cu lead-free soldering paste has good wetting and spreading performance, can remarkably improve the shear strength and reliability of a soldered joint, and can be used for reflow soldering of components in the electronic industry.

Description

technical field [0001] The invention relates to an epoxy resin composite Sn-Ag-Cu lead-free solder paste, which belongs to metal materials and brazing materials in the field of metallurgy. It is mainly used for the assembly and packaging of components in the electronic industry. It is a lead-free solder with good brazing performance and excellent mechanical properties of solder joints. Background technique [0002] With the continuous advancement of electronic packaging technology, the replacement speed of electronic products is getting faster and faster, and the size of solder joints connected to electronic products is getting smaller and smaller. As a result, higher and higher requirements are put forward for the connection strength and reliability of brazed joints. Among the many lead-free solders, Sn-Ag-Cu lead-free solder is undoubtedly the most used. Although its tensile strength and creep resistance are equivalent to those of S-Sn40Pb solder, it still cannot meet the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/36
CPCB23K35/262B23K35/3613
Inventor 张鹏薛鹏刘露顾立勇顾文华薛松柏
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS