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Insulating film for manufacturing electronic device

A technology of electronic devices and insulating films, applied in printed circuits, electrical components, synthetic resin layered products, etc., can solve the problems of printed circuit board bending or warping, unbalanced physical properties and thermal expansion coefficient, waste printed circuit boards, etc. Achieves the effect of preventing bending or warping and excellent flexibility

Pending Publication Date: 2021-12-31
INNOX ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the imbalance of physical properties and coefficient of thermal expansion (Coefficient of Thermal Expansion) between the different materials between the printed circuit board and the insulating film, bending or warping may occur in the printed circuit board bonded with the insulating film
If the printed circuit board is bent or warped, subsequent operations such as circuit formation and laser processing cannot be performed, and problems may arise that require discarding the manufactured printed circuit board or performing manual work
These problems arise because the difference in the thermal expansion coefficient of the insulating film that occurs in the printed circuit board manufacturing process and that of the printed circuit board to which the above insulating film is attached is not accurately adjusted

Method used

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  • Insulating film for manufacturing electronic device
  • Insulating film for manufacturing electronic device
  • Insulating film for manufacturing electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] (1) Preparation of insulating film composition

[0062] The viscosity of 40 parts by weight is the liquid epoxy resin of 2500cps to 2800cps (preparation company: KUKDO chemical company, product name: KDS8161), 40 parts by weight of solid epoxy resin of 40 parts by weight (preparation company: NIPPON KAYAKU company, product name : NC-3000), 20 parts by weight of phenoxy resin (manufacturing company: Gabriel company, product name: PKHH), 4 parts by weight of acrylonitrile-butadiene rubber (manufacturing company: ZEON company, product name: NIPOL 1072CGX) After stirring with 50 parts by weight of solvent naphtha, it was dissolved by heating. After cooling the above mixture at room temperature, mix 40 parts by weight of curing agent (preparation company: DIC company, product name: LA-7052), 0.1 parts by weight of imidazole curing accelerator (preparation company: SHIKOKU company, product name: 2E4MZ ), 120 parts by weight of spherical silica (manufacturing company: ADMATEC, ...

Embodiment 2

[0068] In addition to using 120 parts by weight of spherical silica (manufacturing company: ADMATEC, product name: SC-2050MNS) with an average particle size of 0.5 μm that uses aminosilane to treat the surface instead of the composition of the insulating film in Example 1 above In addition to the spherical silica on the surface treated with epoxy silane during the process, an insulating film and a silicon wafer substrate attached with the above insulating film were prepared in the same manner as in Example 1.

Embodiment 3

[0070] Except that the content of the curing agent in the preparation process of the insulating film composition of the above-mentioned embodiment 1 is adjusted to 30 parts by weight, and the content of spherical silica with an average particle size of 0.5 μm is adjusted to 110 parts by weight, in accordance with the implementation The same method as in Example 1 was used to prepare an insulating film and a silicon wafer substrate with the above insulating film attached thereto.

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Abstract

The present invention provides an insulating film for manufacturing an electronic device as follows; the insulating film is a cured product of the composition; the composition includes: a thermosetting resin including an epoxy component; a thermoplastic resin; a curing agent; and a filler having an average particle size (D50) of 0.1 [mu] m to 3 [mu] m. The present invention can prevent the occurrence of cracks or bending or warping on a substrate during the lamination molding of the electronic component and the insulating film by defining the relationship between the coefficient of thermal expansion before the glass transition temperature (Tg) and the coefficient of thermal expansion after the glass transition temperature; excellent flexibility is shown; the invention can be applied to a flexible substrate, and can also be used as an interlayer adhesive film capable of thinning a multilayer printed circuit board.

Description

technical field [0001] The present invention relates to an insulating film for use in manufacturing electronic devices, and more particularly, to an insulating film that has high heat resistance and low thermal expansion, minimizes warping or warping of electronic device substrates, and can reduce the electronic device substrate. defective rate. Background technique [0002] Recently, circuit boards such as printed circuit boards (PCBs) are manufactured by sequentially laminating and crimping various build-up insulating films for thinner boards and higher integration. [0003] However, due to the imbalance in physical properties and coefficient of thermal expansion (Coefficient of Thermal Expansion) between the different materials between the printed circuit board and the insulating film, bending or warping may occur in the printed circuit board bonded with the insulating film. If the printed circuit board is bent or warped, subsequent operations such as circuit formation a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L71/10C08L9/02C08K9/06C08K7/18C08J5/18B32B9/00B32B9/04B32B27/08B32B27/32B32B27/36
CPCC08J5/18B32B9/00B32B9/04B32B27/08B32B27/32B32B27/36C08J2363/00C08J2463/00C08J2471/10C08J2409/02C08K9/06C08K7/18C08J2371/10B32B2307/206C08L63/00C08L101/00C08L9/02B32B27/38H05K1/036C08K3/36
Inventor 李暎到河泰旭金尚信林栽必申铉一
Owner INNOX ADVANCED MATERIALS CO LTD