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Printed circuit board (PCB) with nickel and gold immersion surface treatment and oxidation resistance surface treatment and manufacturing method thereof

A technology of surface treatment and manufacturing method, which is applied in chemical/electrolytic methods to remove conductive materials, printed circuit manufacturing, electrical components, etc. Erosion damage and contamination, high production precision, good integrity and quality results

Pending Publication Date: 2021-12-31
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned existing technical defects, the present invention provides a PCB manufacturing method with two surface treatments of nickel-immersion gold and anti-oxidation, and uses photosensitive ink to replace the original chemical-resistant gold ink, thereby solving the problem of non-immersion nickel gold PAD. Contamination and False Missing Issues

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0027] A PCB manufacturing method shown in this embodiment with two surface treatments of immersion nickel gold and anti-oxidation includes the following treatment steps in sequence:

[0028] (1) Cutting: Cut out the core board according to the panel size of 520mm×620mm. The thickness of the core board is 0.5mm, and the thickness of the copper layer on both surfaces of the core board is 0.5oz.

[0029] (2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat photosensitive film, the film thickness of the photosensitive film is controlled to 8 μm, use a fully automatic exposure machine, and use a 5-6 grid exposure ruler (21 grid exposure ruler) to complete the exposure of the inner layer circuit, and form the inner layer circuit pattern after development; inner layer etching, etch the exposed and developed core board to etch the inner layer circuit, and the inner layer line width is measured as 3mil; the in...

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PUM

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Abstract

The invention discloses a PCB with two kinds of surface treatment including nickel gold immersion and oxidation resistance and a manufacturing method thereof. The manufacturing method comprises the following steps: printing photosensitive ink on the whole board of a production board in a silk-screen mode; exposing the bonding pad which needs to be subjected to nickel and gold immersion treatment through exposure and development in sequence; pasting a dry film on the production board, and then carrying out windowing on the corresponding bonding pad needing nickel and gold immersion treatment through exposure and development in sequence; carrying out chemical nickel and gold immersion treatment on the production board; sequentially removing the dry film and the photosensitive ink, and then carrying out molding treatment on the production board; and carrying out anti-oxidation treatment on the bonding pad which is not subjected to nickel and gold immersion treatment on the production board. According to the method disclosed by the invention, the photosensitive ink is adopted to replace the original chemical gold resistant ink, so the problems of pollution and false skip plating of the non-nickel-gold deposition PAD are solved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a PCB with two surface treatments of nickel-immersion gold and anti-oxidation and a production method thereof. Background technique [0002] With the rapid development of electronic technology, a single surface treatment process on the same PCB can no longer meet customer needs. It is becoming more and more important to develop a combination of multiple surface treatments. There will be mutual interference during processing, which increases the technical difficulty. [0003] The current practice is: when the distance between two PADs that require two surface treatment processes is greater than 0.2 mm, use the screen printing anti-chemical gold ink process to cover the local non-immersion nickel gold PAD; when two surface treatments are required When the distance between the two PADs of the process is less than 0.2mm, it exceeds the process capability of ...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/06H05K3/0011
Inventor 陈勇武刘百岚张义兵张华勇寻瑞平
Owner JIANGMEN SUNTAK CIRCUIT TECH