Preparation of high-performance flame-retardant heat-conducting adhesive applied to electronic industry

Abstract

The invention provides preparation of a high-performance flame-retardant heat-conducting adhesive applied to the electronic industry, and relates to the technical field of heat-conducting adhesives. The high-performance flame-retardant heat-conducting adhesive applied to the electronic industry comprises the following components in parts by weight: 95-98 parts of raw methyl vinyl rubber, 2-5 parts of vinyl silicone resin, 20-40 parts of modified zinc oxide, 180-220 parts of an inorganic flame retardant, 30-50 parts of modified aluminum oxide, 0.5 part of a coupling agent and 3-5 parts of a bis(2,5-dimethyl-2,5-dioxane) vulcanizing agent. By mixing the raw methyl vinyl rubber with relatively low molecular weight and a small amount of liquid vinyl silicone resin, powder absorbing capability is improved, and the resin with high molecular weight can meet the requirement of low oil yield; the inorganic flame retardant, the modified aluminum oxide and the modified zinc oxide are matched with the coupling agent for use, so compatibility with the vinyl silicone resin component is increased, filling capacity is improved, the flame-retardant effect and the heat-conducting effect are obtained at the same time, and the mechanical property of a vulcanized finished product is ensured; and reasonable particle size matching not only can improve a filling amount, but also can help a material product to form a compact ceramic layer for heat insulation and improve the flame-retardant effect during combustion.

Description

technical field [0001] The invention relates to the technical field of heat-conducting adhesives, in particular to the preparation of high-performance flame-retardant heat-conducting adhesives for the electronics industry. Background technique [0002] With the development of science and technology, the requirements for materials in the electronics industry are increasing day by day. It is a common safety requirement for thermal conductive materials to meet UL94 V-0, and the thickness is required to be thinner and thinner. [0003] Generally, the flame retardant grade of filled flame retardant materials increases with the increase of the filling ratio of flame retardant fillers. At present, in order to ensure good operability and mechanical properties of products, flame retardant compounds on the market generally only have lower filling ratios. The flame retardant can only achieve the thickness of UL94 V-0 above 1.5mm; although filling a small amount of high-efficiency flame...

AI Technical Summary

Problems solved by technology

[0007] Aiming at the deficiencies of the prior art, the present invention provides a preparation of a high-performance flame-retardant heat-conducting adhesive for the electronics industry, which solves the problem in the existing electronics industry that the flame-retardant grade meets the thickness ≥ 0.5mm, UL94 V-0, and has comparable The mechanical properties of ordinary compound rubber products, and has good thermal conductivity, no oil leakage, and meets the needs of comprehensive performance of thermal conductivity and flame retardant materials such as 150 ° C reliability test requirements