Welding method for applying copper water heat pipe to aluminum plate

A welding method and heat pipe technology, applied in welding equipment, welding equipment, auxiliary welding equipment, etc., can solve problems such as poor contact and large contact thermal resistance, and achieve the effects of improving welding efficiency, ensuring welding quality, and ensuring consistency

Pending Publication Date: 2022-01-11
XIAN INSTITUE OF SPACE RADIO TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are problems such as large contact thermal resistance and poor contact between the copper water heat pipe and the casing through a thermal pad or direct contact. At present, there is no welding method for copper water heat pipes applied to aluminum plates, which can solve the problem of large contact thermal resistance and poor contact. And other issues

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  • Welding method for applying copper water heat pipe to aluminum plate
  • Welding method for applying copper water heat pipe to aluminum plate

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Embodiment Construction

[0027] The present invention will be further elaborated below in conjunction with embodiment.

[0028] The invention proposes a copper-water heat pipe applied to a welding process on an aluminum plate to meet the heat dissipation requirements of high-power devices. Compared with the traditional heat dissipation method, the thermal conductivity of the original aluminum alloy is increased from 188W / (m-K) to 104~105W / (m-K), which is hundreds or even thousands of times that of ordinary metal materials, and improves the thermal conductivity in vacuum environment. The heat dissipation of components is difficult to meet the heat dissipation requirements of a single machine.

[0029] The copper water heat pipe is applied to the welding method on the aluminum plate, which specifically includes the following steps:

[0030] Step 1. Use a heat press to press the cylindrical heat pipe into a flat heat pipe. The thickness of the flat heat pipe after pressing is 3mm, and the flatness of th...

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Abstract

The invention relates to a welding method for applying a copper water heat pipe to an aluminum plate, and belongs to the technical field of heat dissipation of satellite effective load large-heat-consumption components. A cylindrical heat pipe is pressed into a flat heat pipe, and the flatness of the outer wall of the flat heat pipe meets the requirement; oxide on the surface of the flat heat pipe is polished with abrasive paper; the upper surface of a machine shell is provided with a groove with a special-shaped trend, and the cross section of the groove is rectangular; the outer edges of the upper and lower surfaces of the machine shell are coated with adhesive tapes for protection; a soldering lug is cut into a shape corresponding to the trend of the groove, the soldering lug is flattened, and the flattened soldering lug is placed at the bottom of the groove; the machine shell is horizontally placed on the upper surface of a lower pressing plate; the heat pipe is placed in the groove along the trend of the groove; an upper pressing plate covers the upper surface of the machine shell; an upper clamping tool is clamped on the outer edges of the upper pressing plate and the lower pressing plate to form an integral tool; and the integral tool is placed in welding equipment to be welded, and welding of the heat pipe and the machine shell is completed. By means of the welding method, the heat dissipation requirement of a high-power device is met.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of satellite payload components with large heat consumption, and relates to a welding method for applying a copper water heat pipe to an aluminum plate. Background technique [0002] This project originates from the research and development of data processor stand-alone machines of multiple models. This kind of stand-alone machine has a high data transmission rate, complex task processing, and the heat consumption of the single board reaches more than 35W. It is no longer possible to adopt the traditional heat sink heat dissipation method. Meet heat dissipation requirements. In order to solve the heat dissipation problem, heat pipes + heat dissipation bosses + heat conduction pads are used to dissipate heat from the device. Generally, during the thermal vacuum and thermal cycle tests of high-power single-unit payloads in the cabin, the temperature of the single-unit installation surface i...

Claims

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Application Information

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IPC IPC(8): B23K31/02B23K37/00
CPCB23K31/02B23K37/00
Inventor 马贞韩婷郭高龙任联锋杨东林黄超马涛
Owner XIAN INSTITUE OF SPACE RADIO TECH
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