Manufacturing method of groove and manufacturing method of memory device
A manufacturing method and storage device technology, which are applied in the field of storage device fabrication and trench fabrication, can solve problems such as difficulties, and achieve the effects of improving function, improving resolution and fidelity, and reducing etching rate.
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[0052] For reference and clarity, descriptions, abbreviations or abbreviations of technical terms used in the following text are summarized as follows:
[0053] BARC: Bottom Anti Reflection Coating, bottom anti-reflection coating;
[0054] ODL: Organic Dielectric Layer, organic dielectric layer;
[0055] SHB: Si-O-based Hard Mask, silicon oxide hard mask interlayer structure layer.
[0056] As mentioned in the background art, it is difficult to further reduce the critical dimension (CD) of the U-shaped trench in the existing semi-floating gate transistor manufacturing process. The main reason for restricting the shrinkage of the groove (U-shaped groove) is: the ODL layer, the mask layer for making the groove, is adopted due to its excellent step coverage performance, but its loose characteristics make it easy to be etched laterally. As a result, the CD of the trench is enlarged.
[0057] Specifically, use the ODL layer as a mask to etch the substrate to form a groove, and i...
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