Heat-conducting filler and anti-aging organic silicon heat-conducting gel prepared from heat-conducting filler

A heat-conducting filler and gel technology, which is applied in the field of aging-resistant silicone heat-conducting gels, can solve problems such as hardness climbing, precipitation of silicone oil, and decrease in flexibility, affecting heat conduction and heat dissipation performance, so as to reduce oil separation and improve high-temperature aging resistance The effect of low performance and hardness climb

Pending Publication Date: 2022-02-08
世晨材料技术(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the high-temperature aging process, conventional thermal gels will have problems such as hardness rise, silicone oil precipitation, and flexibility decline, which will seriously affect their thermal conductivity and heat dissipation performance, and cannot meet the application requirements of precision electronic components.

Method used

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  • Heat-conducting filler and anti-aging organic silicon heat-conducting gel prepared from heat-conducting filler
  • Heat-conducting filler and anti-aging organic silicon heat-conducting gel prepared from heat-conducting filler
  • Heat-conducting filler and anti-aging organic silicon heat-conducting gel prepared from heat-conducting filler

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Step 1: Dissolve the silane modifier DA30 (Ambia Special Silicon Co., Ltd., with hydroxyl groups at both ends and methyl and vinyl branches in the branch chain) in acetone to make a modifier solution; the aluminum oxide and graphene oxide The ratio is 6:4, and the alumina and graphene oxide fillers are weighed and added to a sand mill for dispersion.

[0031] Step 2: Transfer the uniformly dispersed mixed filler to the reactor, raise the temperature to 90°C with stirring, preheat for 20 minutes, spray the silane modifier solution into the filler under stirring, and control the injection rate at 70g / min.

[0032] Step 3: keep stirring for 1 hour, add 30% methyltrimethoxysilane toluene solution, complete the reaction, cool to room temperature, transfer the filler to a 120°C oven and bake for 2 hours to obtain a thermally conductive filler.

Embodiment 2

[0033] Example 2: Thermally conductive filler prepared by using KH560 silane modifier.

[0034] Step 1: Dissolve KH560 (γ-glycidyl etheroxypropyltrimethoxysilane) in acetone to make a modifier solution; the ratio of alumina to graphene oxide is 6:4, weigh alumina and oxide Graphene filler is added into a sand mill for dispersion.

[0035] Step 2: Transfer the uniformly dispersed mixed filler to the reactor, raise the temperature to 90°C with stirring, preheat for 20 minutes, spray the silane modifier solution into the filler under stirring, and control the injection rate at 70g / min.

[0036] Step 3: keep stirring for 1 hour, add 30% methyltrimethoxysilane toluene solution, complete the reaction, cool to room temperature, transfer the filler to a 120°C oven and bake for 2 hours to obtain a thermally conductive filler.

Embodiment 3

[0037] Example 3: Alumina and graphene oxide were compounded at a ratio of 5:5 to obtain a thermally conductive filler.

[0038] Step 1: Dissolve DA20 (Ambia Special Silicon Co., Ltd., with alkoxy groups at both ends and methyl and vinyl branches in the branch chain) in acetone to make a modifier solution; the ratio of alumina to graphene oxide is 5:5, weigh alumina and graphene oxide fillers, add them into a sand mill for dispersion.

[0039] Step 2: Transfer the uniformly dispersed mixed filler to the reactor, raise the temperature to 90°C with stirring, preheat for 20 minutes, spray the silane modifier solution into the filler under stirring, and control the injection rate at 70g / min.

[0040] Step 3: keep stirring for 1 hour, add 30% methyltrimethoxysilane toluene solution, complete the reaction, cool to room temperature, transfer the filler to a 120°C oven and bake for 2 hours to obtain a thermally conductive filler.

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Abstract

The invention discloses a heat-conducting filler and an anti-aging organic silicon heat-conducting gel prepared from the heat-conducting filler, and belongs to the field of thermal interface materials. The organic silicon heat-conducting gel is prepared from the following components in parts by weight: 100 parts of vinyl-terminated silicone oil, 5-10 parts of hydrogen-containing silicone oil, 1000-1600 parts of heat-conducting filler, 0.02-0.05 parts of inhibitor and 0.1-0.3 parts of catalyst. A silane-modified aluminum oxide and graphene oxide compound heat-conducting filler is prepared, a silane modifier is dissolved in an organic solvent to prepare a modifier solution, and aluminum oxide and graphene oxide can be connected together through silane. The two ends of the silane modifier are hydroxyl groups, the branched chains are methyl and vinyl, a vinyl unit in silane can be crosslinked with hydrogen-containing silicone oil through a hydrosilylation reaction, and the base rubber and the filler form a whole. The compatibility between the heat-conducting filler and the silicone rubber is improved, the hardness climbing at a high temperature is reduced, the heat-conducting property of the heat-conducting gel is remarkably improved, and the problems of limited addition amount, high cost and the like when graphene is independently used are solved.

Description

technical field [0001] This patent relates to the technical field of thermal interface materials, in particular to a heat-conducting filler and an aging-resistant silicone heat-conducting gel prepared by the heat-conducting filler. Background technique [0002] The heat generated by semiconductors must be dissipated to the surrounding environment in order to keep the temperature of the semiconductor component junction within the safe operating range. Usually, this heat dissipation process requires the use of a heat sink to diffuse heat; if the heat sink is fixed to the surface of the semiconductor package, the two surfaces need to be in close contact. When the two above-mentioned surfaces are connected together, only the high point will have contact, and the low point will form an air gap. Generally, there will be more than 90% air gap in the contact area, which will cause a large increase in thermal resistance. . [0003] In order to eliminate these air gaps on the contac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/06C08K3/22C08K3/04C08L83/07C08L83/05C09K5/14
CPCC08K9/06C08K3/22C08K3/042C08L83/04C09K5/14C08K2003/2227C08L2201/08
Inventor 顾正青李马刚周奎任陈启峰
Owner 世晨材料技术(上海)有限公司
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