Multi-channel 77GHz low-profile microstrip antenna array structure

Abstract

The invention discloses a multi-channel 77GHz low-profile microstrip antenna array structure and belongs to the field of millimeter wave radar antennas. The structure comprises at least one remote antenna and at least one short-range antenna; each remote antenna comprises m transmitting arrays, wherein m is a positive integer; the plurality of remote antennas share n receiving arrays, wherein n is a positive integer; each short-range antenna comprises a transmitting arrays, wherein a is a positive integer; the plurality of remote antennas share b receiving arrays, wherein b is a positive integer; the equivalent receiving array aperture of the remote antennas is the sum of the array apertures of the receiving arrays of the remote antennas; and the equivalent receiving array aperture of the short-range antennas is the sum of the array apertures of the receiving arrays of the short-range antennas. According to the antenna array structure, compression of azimuth beam angles is realized through modes of aperture cascade expansion, digital beam forming and the like, the azimuth high-resolution capability and the pitch ratio phase measurement angle of a system are improved, and then perception of a target three-dimensional space is realized.

Description

technical field [0001] The invention relates to the field of millimeter-wave radar antennas, in particular to a multi-channel 77GHz low-profile microstrip antenna array. Background technique [0002] The traditional millimeter-wave radar system generally divides the radar subsystem by modules. In order to realize the integrated and miniaturized radar design, an integrated chip-based RF channel design is adopted. [0003] Compared with 24G radar, 77G radar has the characteristics of higher frequency and more difficult integration. The radar system has the characteristics of light weight, small size, high system assembly density, and multiple assembly levels, which puts forward extremely high requirements for the assembly process. The high-density and high-reliability assembly process is the guarantee for the success of the system. Assembly technology includes environmental control, tool design and preparation, substrate integrity control and testing, component on-line testi...

AI Technical Summary

Problems solved by technology

[0006]The existing planar antenna layout can only realize the precise measurement of azimuth or distance, but cannot realize the precise measurement of pitch angle, and then cannot realize the three-dimensional space measurement of the target. The understanding of the attributes of the target will create obstacles, which is not conducive to the understanding of the specific characteristics of the target

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