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Film bulk acoustic resonator and manufacturing method thereof

A thin-film bulk acoustic wave and manufacturing method technology, applied in the direction of electrical components, impedance networks, etc., can solve the problems of radio frequency systems that cannot meet high performance, the quality factor cannot be further improved, and the quality factor is poor, so as to strengthen the firmness and avoid damage , the effect of preventing sound wave leakage

Pending Publication Date: 2022-02-18
NINGBO SEMICON INT CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the thin film bulk acoustic resonator produced at present, after the piezoelectric layer is dug, the entire device structure is supported by a layer of piezoelectric film, and the structure is easily broken during the process, resulting in low yield and quality factors. Bad problems, and its quality factor (Q) cannot be further improved, so it cannot meet the needs of high-performance radio frequency systems

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  • Film bulk acoustic resonator and manufacturing method thereof
  • Film bulk acoustic resonator and manufacturing method thereof
  • Film bulk acoustic resonator and manufacturing method thereof

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Embodiment Construction

[0040] The cavity-type thin-film bulk acoustic resonators produced at present have problems such as sound wave loss and insufficient structural strength, so that the quality factor (Q) cannot be further improved, and the yield is low, so they cannot meet the needs of high-performance radio frequency systems.

[0041] In order to solve the above problems, the present invention provides a thin film bulk acoustic resonator. By filling the trench with a dielectric layer, it forms a support with the electrodes in the region where the trench is located, thereby enhancing the firmness of the device structure and avoiding the resonator structure. damage, protect the device structure, and improve device performance.

[0042] The thin film bulk acoustic resonator and its manufacturing method of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. According to the following description and accompanying drawi...

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Abstract

The invention relates to a film bulk acoustic resonator and a manufacturing method thereof; the film bulk acoustic resonator comprises a first substrate and a support layer arranged on the first substrate, wherein the support layer is provided with a first cavity; a piezoelectric laminated structure, which covers the first cavity, and comprises a first electrode, a piezoelectric layer and a second electrode which are laminated in sequence; a first groove that is formed in the piezoelectric laminated structure and penetrates through the first electrode and the piezoelectric layer, and the first groove is communicated with the first cavity; a second groove that is formed in the piezoelectric laminated structure and penetrates through the second electrode and the piezoelectric layer, wherein an area enclosed by the first groove and the second groove is an effective resonance area of the resonator; and a dielectric layer arranged in the first groove and / or the second groove. According to the invention, the dielectric layer is filled in the groove to form a support with the electrode in the area where the groove is located, so that the firmness of the device structure is enhanced, the resonator structure is prevented from being damaged; in addition, acoustic impedance mismatch is formed to prevent sound wave leakage.

Description

technical field [0001] The invention relates to the field of semiconductor device manufacturing, in particular to a thin-film bulk acoustic wave resonator and a manufacturing method thereof. Background technique [0002] Since the development of analog RF communication technology in the early 1990s, RF front-end modules have gradually become the core components of communication equipment. Among all RF front-end modules, filters have become the components with the strongest growth momentum and the greatest development prospects. With the rapid development of wireless communication technology and the maturity of 5G communication protocols, the market has also put forward stricter standards for the performance of RF filters in all aspects. The performance of a filter is determined by the resonator units that make up the filter. Among the existing filters, the film bulk acoustic resonator (FBAR) has the characteristics of small size, low insertion loss, large out-of-band suppr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02H03H9/02H03H9/17H03H9/13
CPCH03H3/02H03H9/02015H03H9/174H03H9/173H03H9/02086H03H9/02H03H9/131H03H2003/023H03H2003/028H03H2009/02173
Inventor 李伟罗海龙
Owner NINGBO SEMICON INT CORP
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