High-performance power supply control board

A power control and high-performance technology, which is applied in the fields of printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of difficult splicing of power control boards, uneven copper plating thickness, and low plating efficiency, so as to reduce the risk of seepage, The effect of improving processing efficiency and uniformity, and improving the uniformity of copper plating

Pending Publication Date: 2022-03-01
广德今腾电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a high-performance power control board to solve the problems of low electroplating efficiency, uneven copper plating thickness, difficult splicing of power control boards, and difficult splicing of different surfaces in the above-mentioned background technology

Method used

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Embodiment

[0037] see Figure 1-Figure 5 , the present invention provides a high-performance power control board, including a power control board 1 and a power control board connector 2 , the power control board connector 2 is fixedly installed on the side of the power control board 1 .

[0038] Specifically, such as Figure 4 As shown, the power control board 1 includes a substrate 101, a bottom copper 102, a solder resist wet film layer 103, a dry film layer 104 and a thick copper layer 105, the substrate 101 is provided with a bottom copper 102, and the bottom copper 102 is coated with a solder resist wet film Layer 103, dry film layer 104 is laminated on solder resist wet film layer 103, thick copper layer 105 is set on bottom copper 102, and layered processing ensures the continuity of transmission, improves protection ability, and reduces the risk of seepage plating.

[0039] Specifically, such as figure 1 , figure 2 and image 3 As shown, the power control board connector 2 i...

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Abstract

The invention relates to the technical field of electronic appliances, in particular to a high-performance power control board which comprises a power control board body and a power control board connecting piece fixedly mounted on the side of the power control board body. The production continuity is maintained, the uniformity is improved, the thin copper layer is adopted for electric conduction, a conventional pattern electroplating processing mode is referred, the thickness uniformity of a plated area is relatively good, and the copper thickness range can be controlled within 10 microns, so that the transmission continuity of a thick copper area is ensured, the thick copper area and a conventional order can be processed at the same time, and the production efficiency is improved; the current transmission is uniform, the copper plating uniformity can be improved, the wet film is adopted to fill the step gap according to the local thick copper characteristic of the product, the protection capability is improved, the outer edge of the power supply control board can be quickly butted with the butted power supply control board in any shape, the efficiency is high, the speed is high, and the splicing difficulty is reduced.

Description

technical field [0001] The invention relates to the technical field of electronic appliances, in particular to a high-performance power supply control board. Background technique [0002] Conventional power boards generally need to be made of thick copper, and common thick copper is made of buried copper block or thick copper copper foil. The buried copper block method is only suitable for power boards with relatively simple graphics, and the method of using thick copper and copper foil cannot realize signal transmission control. For printed boards with signal requirements and thick copper current-carrying requirements, it is necessary to use thin copper for the control module circuit to ensure signal stability. At the same time, the local copper thickness needs to be thickened to ensure the current carrying capacity of the printed board. [0003] The commonly used method in the industry is electroplating lead processing: [0004] 1) Low electroplating efficiency: The cur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/28H05K3/02
CPCH05K1/14H05K3/28H05K3/022
Inventor 刘鹍李晓雷陶樱红李玮霖张胜男
Owner 广德今腾电子科技有限公司
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