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Preparation method of novel multifunctional light-emitting triode device

A light-emitting triode, multi-functional technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of difficult to ensure accuracy, photolithography process is difficult to ensure accuracy, etc., to achieve the effect of simple process

Pending Publication Date: 2022-03-18
MINDU INNOVATION LAB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention proposes a method for preparing a novel multifunctional light-emitting triode device. The purpose of the design is to solve the problem of precision that is difficult to guarantee in the photolithography process, and to complete the preparation of LED integrated devices with a simpler process.
Compared with the existing technology, the solution of the present invention solves the problem of precision that is difficult to guarantee in the photolithography process, reduces the difficulty of device preparation, saves the production cost, and is of great significance for improving the efficiency of device preparation

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  • Preparation method of novel multifunctional light-emitting triode device
  • Preparation method of novel multifunctional light-emitting triode device
  • Preparation method of novel multifunctional light-emitting triode device

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Embodiment Construction

[0030] In order to make the features and advantages of this patent more obvious and easy to understand, the following special examples are described in detail as follows:

[0031] Such as Figure 1-Figure 8 As shown, this embodiment provides a preparation method for preparing a novel multifunctional light-emitting triode device, including the following process steps;

[0032] Step S1: providing a semiconductor substrate, depositing the first N-type semiconductor layer 1 on the substrate;

[0033] Step S2: making a mask layer 2 by photolithography, exposing a predetermined area on the first N-type semiconductor 1 to the outside of the mask layer 2;

[0034] Step S3: making a dielectric layer 3 on the first N-type semiconductor layer 1 and the mask layer 2;

[0035] Step S4: remove the mask layer, and prepare the first P-type semiconductor layer 4 on the first N-type semiconductor layer 1;

[0036] Step S5: remove the dielectric layer formed in step S3 by wet etching, prepare...

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Abstract

The invention provides a preparation method of a novel multifunctional light-emitting triode device, which comprises the following steps of: in the growth process of an epitaxial layer of the light-emitting triode device, performing epitaxial growth for multiple times, and controlling the structure of the device by preparing a dielectric layer and performing wet etching in each epitaxial process; wherein the prepared dielectric layer is used for controlling an effective area of next epitaxial growth; and wet etching is used for removing the dielectric layer. The process comprises the steps of semiconductor photoetching, semiconductor epitaxy, wet etching, preparation of a mask layer through photoetching, preparation of a dielectric layer in an area outside the mask layer, removal of the mask layer and the like to prepare the semiconductor layer. Compared with the prior art, the scheme provided by the invention solves the problem that the precision is difficult to guarantee in a photoetching process, reduces the difficulty of device preparation, saves the manufacturing cost, and has important significance for improving the device preparation efficiency.

Description

technical field [0001] The invention belongs to the technical field of manufacturing optoelectronic light-emitting devices, and in particular relates to a preparation method of a novel multifunctional light-emitting triode device. Background technique [0002] LED has the advantages of high brightness, high light efficiency, long life, high contrast, and nanosecond response time. But traditional LED technology for lighting and displays often requires specialized electronic drive circuits. Traditional electronic drive circuits are usually realized by discrete devices. Such discrete drive circuits have problems such as bulky size, parasitic parameters, and packaging caused by peripheral circuits. At present, it is a common technical means to integrate the driving circuit and LED on the same wafer. [0003] The current mainstream LED micro-display integrated drive technology is to integrate LEDs and transistors, such as MOS tubes, FETs, and BJTs. The bipolar transistor (BJT)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/02H01L33/36H01L33/00
CPCH01L33/02H01L33/36H01L33/005
Inventor 周雄图陈晶晶郭太良张永爱吴朝兴严群孙捷
Owner MINDU INNOVATION LAB