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Resin toughening composition, resin toughening modifier, modified bismaleimide resin composition, and cured product

A technology of bismaleimide resin and bismaleimide, which is applied in the field of modified bismaleimide resin composition and cured product, can solve the problem of poor toughness of bismaleimide resin and reduce the Bismaleimide resin performance and scope of use and other issues, to achieve toughness enhancement, expand the performance and scope of use, improve the effect of mechanical properties

Pending Publication Date: 2022-03-22
LUOYANG INST OF CUTTING EDGE TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide a kind of resin toughening composition, resin toughening modifier, modified bismaleimide resin composition and cured product, to improve the poor toughness of bismaleimide resin , to a certain extent reduces the technical problems of bismaleimide resin performance and range of use

Method used

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  • Resin toughening composition, resin toughening modifier, modified bismaleimide resin composition, and cured product
  • Resin toughening composition, resin toughening modifier, modified bismaleimide resin composition, and cured product

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preparation example Construction

[0027] In some embodiments of the present application, the preparation method of the resin toughening modifier includes: step S1, performing an addition reaction of diphenylmethane bismaleimide and diaminodiphenylmethane to obtain an addition product system; In step S2, the addition product in the addition product system is subjected to a ring-opening reaction with bisphenol A diglycidyl ether to obtain a resin toughening modifier.

[0028] In above-mentioned step S1, diaminodiphenylmethane and diphenylmethane bismaleimide add reaction, when expanding the molecular chain of diphenylmethane bismaleimide, introduce active The amino group of hydrogen is conducive to the subsequent reaction of the active hydrogen on the amino group with the substance containing the flexible chain to introduce a flexible group.

[0029] In some preferred embodiments of the present application, step S1 includes: A, dissolving diphenylmethane bismaleimide and diaminodiphenylmethane in a solvent respe...

Embodiment 1

[0065] This embodiment provides a resin toughening modifier, which is prepared according to the following steps:

[0066] (1) Dissolve 30g of diphenylmethane bismaleimide in 200mL N,N-dimethylacetamide, stir evenly to completely dissolve diphenylmethane bismaleimide in N,N-dimethylacetamide in acetamide. Dissolve 30g of diaminodiphenylmethane in 250mL of N,N-dimethylacetamide, and stir evenly to completely dissolve the diaminodiphenylmethane in N,N-dimethylacetamide. Mix the above two solutions, stir and react at 80-90°C for 30 minutes, pour the above solution into distilled water after the reaction, cool and crystallize at 20-30°C, then filter and dry to obtain the addition product.

[0067] (2) Heat 40g of bisphenol A diglycidyl ether at 80-90°C for 30 minutes, add the addition product, heat at 90-100°C for 40-50 minutes, and cool to obtain a resin toughening modifier.

Embodiment 2

[0069] This embodiment provides a resin toughening modifier, which is prepared according to the following steps:

[0070] (1) Dissolve 55g of diphenylmethane bismaleimide in 400mL N,N-dimethylacetamide, stir evenly to completely dissolve diphenylmethane bismaleimide in N,N-dimethylacetamide in acetamide. Dissolve 15g of diaminodiphenylmethane in 130mL of N,N-dimethylacetamide, and stir evenly to completely dissolve the diaminodiphenylmethane in N,N-dimethylacetamide. Mix the above two solutions, stir and react at 80-90°C for 30 minutes, pour the above solution into distilled water after the reaction, cool and crystallize at 20-30°C, then filter and dry to obtain the addition product.

[0071] (2) Heat 30 g of bisphenol A diglycidyl ether at 80-90°C for 30 minutes, add the addition product, heat at 90-100°C for 40-50 minutes, and cool to obtain a resin toughening modifier.

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Abstract

The invention provides a resin toughening composition, a resin toughening modifier, a modified bismaleimide resin composition and a cured product. The resin toughening composition is prepared from the following components in percentage by mass: 30 percent to 55 percent of diphenylmethane bismaleimide, 15 percent to 30 percent of diaminodiphenylmethane, 15 percent to 30 percent of diaminodiphenylmethane and 20 percent to 40 percent of bisphenol A diglycidyl ether. Diphenylmethane bismaleimide and diaminodiphenylmethane are subjected to an addition reaction to expand a molecular chain of diphenylmethane bismaleimide, reactive hydrogen on an amino group of an addition product and an epoxy group in bisphenol A diglycidyl ether are subjected to a ring-opening reaction, and a flexible group is introduced. According to the toughening composition, the crosslinking density of a bismaleimide resin cured product can be reduced, a flexible chain can rotate, the toughness of the resin is enhanced, meanwhile, the mechanical property of the resin can be improved, and the use performance and the use range can be expanded.

Description

technical field [0001] The invention relates to the technical field of bismaleimide resins, in particular to a resin toughening composition, a resin toughening modifier, a modified bismaleimide resin composition and a cured product. Background technique [0002] Bismaleimide resin is a high-performance thermosetting resin widely used in the aerospace field. It has a high glass transition temperature, good heat and humidity resistance, electrical insulation, flame retardancy, radiation resistance and Mechanical properties, making it a major contender in the field of thermosets. However, the rigid structure and large crosslink density of bismaleimide resin, and the presence of polar carbonyl groups make the polymer chains pile up orderly, which reduces the probability of energy dissipation and leads to the toughness of bismaleimide resin. Poor, to a certain extent reduces the performance and range of use of bismaleimide resin. [0003] In view of this, the present invention ...

Claims

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Application Information

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IPC IPC(8): C08G59/50C08G59/24C08L79/08C08L63/02C08L81/06
CPCC08G59/506C08G59/245C08L79/085C08L63/00C08L79/08C08L81/06
Inventor 刘若鹏赵治亚张丹辉张运湘
Owner LUOYANG INST OF CUTTING EDGE TECH
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