Method for controlling magnetron sputtering equipment in HJT battery production
A magnetron sputtering and equipment technology, applied in sputtering coating, circuits, electrical components, etc., can solve the problems affecting the coating efficiency and productivity, high battery voltage, and many manpower and material resources required to improve efficiency and The effect of productivity, life cycle improvement, manpower and material saving
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[0020] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0021] Such as figure 1 As shown, the method for manipulating magnetron sputtering equipment in HJT battery production provided by the present invention comprises the following steps:
[0022] S1, install the ITO rotating target on the target position of the magnetron sputtering equipment.
[0023] S2, evacuate the magnetron sputtering equipment, and evacuate the vacuum degree of the magnetron sputtering equipment to below 2E-4Pa.
[0024] S3, setting the rotational speed of the target to 5 rap, and turning on the target rotation.
[0025] Wherein, the rotational speed refers to the rotational speed of the rotating motor that controls the target material. The rotational...
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