Resin composition and application thereof

Abstract

The invention provides a thermosetting resin composition and application thereof. The thermosetting resin composition comprises the following components in parts by weight: 100 parts of epoxy resin; by weight, the ratio of the reactive hydrogen equivalent of the aromatic amine curing agent to the epoxy equivalent of the epoxy resin is 0.5-2.0; the co-curing agent is selected from one or a combination of more of 1, 8-diazabicyclo-bicyclo (5, 4, 0)-7-undecene (DBU) and salts thereof, and 1, 5-diazabicyclo (4, 3, 0) nonyl-5-ene (DBN) and salts thereof, and the weight ratio of the co-curing agent to the aromatic amine curing agent is 0.05-0.35 by weight; the epoxy resin, the aromatic amine curing agent and the co-curing agent are co-cured, and the addition amount of the tough resin accounts for 0.01-0.5 of the total weight of the epoxy resin, the aromatic amine curing agent and the co-curing agent.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a resin composition and its application. Background technique [0002] At present, the rigid-flex printed circuit board is a kind of printed circuit board that is currently in demand and developing. The rigid-flex printed circuit board is a circuit board that combines a thin layer of flexible bottom layer and a rigid bottom layer, and then laminates them into a single component to form a circuit board. The rigid-flex board has changed the traditional planar design concept. Expanding to the three-dimensional concept of three-dimensional space, while bringing great convenience to product design, also brings great challenges. A typical (four-layer) rigid-flex printed circuit board has a polyimide core covered with copper foil on both the upper and lower sides. The outer rigid layer consists of single-sided FR-4 (epoxy fiberglass cloth substrate) laminated into both si...

AI Technical Summary

Problems solved by technology

However, the technical solution in this patent has the problem of high powder removal rate caused by insufficient toughness, which will seriously affect the processing performance of printed circuit boards

In order to improve the toughness of low-flow adhesive prepreg, too much bisphenol A epoxy resin is added, which will lead to a lower glass transition temperature.

[0005] In order to improve the toughness and powder removal rate of low-flow rubber prepregs, macromolecular polymers such as phenolic resin, nitrile rubber, and polyacrylate resin are usually added to the resin system in the prior art. However, too many macromolecular polymers are added. It will reduce the wettability of the resin system to the glass fiber cloth, and form defects such as resin voids inside the prepreg, which will lead to a decrease in the reliability of the low-flow adhesive prepreg after lamination

[0006] Therefore, the development of a new resin composition and the low-flow adhesive prepreg made by using it can not only improve the bonding force between the low-flow adhesive prepreg and the polyimide surface of the soft board, but also ensure that the low-flow adhesive prepreg has excellent heat resistance. Performance, toughness and low powder removal rate, and can avoid the problem of the resin system's wettability of glass fiber cloth, which obviously has positive practical significance

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