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Electronic component slurry and processing technology thereof

A technology of electronic components and processing technology, which is applied in the field of electronic component slurry and its processing technology, can solve the problems of low processing efficiency, and achieve the effects of high processing efficiency, convenient use and good adjustment

Inactive Publication Date: 2022-04-12
淮安市宝鼎科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a slurry for electronic components and its processing technology, which solves the problem that different raw materials usually need to be mixed separately during the processing of the currently used slurry for electronic components, and then The mixture mixed separately is added together for mixing, and multiple mixing devices need to be replaced, and the processing efficiency is low

Method used

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  • Electronic component slurry and processing technology thereof
  • Electronic component slurry and processing technology thereof
  • Electronic component slurry and processing technology thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] see figure 1 , the present invention provides a technical solution: a slurry for electronic components, comprising the following percentage components:

[0049] Propyl acetate and isobutanol equal volume mixed solvent 13%~17%;

[0050] Polyacrylic resin 11% to 13%;

[0051] Ferrite powder 30% to 35%;

[0052] Epoxy resin 5% to 8%;

[0053] Calcium phosphite 8% to 10%;

[0054] Calcium stearate 8% to 10%;

[0055] Silane coupling agent 1% to 1.5%.

[0056] A processing technology of electronic component paste, comprising the following steps:

[0057] S1. Put propyl acetate and isobutanol in an equal amount of mixed solvent, polyacrylic acid resin and calcium phosphite into the mixing device and mix evenly to obtain mixture A;

[0058] S2. Put ferrite powder, epoxy resin, calcium stearate and silane coupling agent into the mixing device and mix evenly to obtain mixture B;

[0059] S3, put the mixture A and the mixture B obtained in S1 and S2 together into the mixi...

Embodiment 2

[0062] see Figure 1-4 , On the basis of Embodiment 1, the present invention provides a technical solution: a processing technology of electronic component slurry, the mixing device includes:

[0063] Mixing barrel 1, the bottom of the mixing barrel 1 is provided with a fixed base 2, and one side of the bottom of the mixing barrel 1 is provided with a discharge port 3;

[0064] A mixing device 4, the mixing device 4 is arranged inside the mixing barrel 1, the top of the mixing barrel 1 is provided with a top cover 5, and the top of the top cover 5 is connected with a feeding port;

[0065] Drive motor 6, the drive motor 6 is arranged on the top of the top cover 5, the drive motor 6 is fixedly connected to the top of the top cover 5 through the bracket, the drive shaft of the drive motor 6 runs through the top cover 5 and extends to the inside of the mixing barrel 1;

[0066] Mixing device 4 comprises:

[0067] A mixing box 41, the bottom of the inner wall of the mixing box 4...

Embodiment 3

[0076] see Figure 1-5 On the basis of Embodiment 1, the present invention provides a technical solution: the control device 46 includes a control panel 461, the inner wall of the control panel 461 is penetrated and is threadedly connected with a control tube 462, and the top of the control panel 461 is located on both sides of the control tube 462. A telescopic rod 463 is fixedly connected, and the end of the telescopic rod 463 close to the control tube 462 is fixedly connected with a chuck 464, and both sides of the control panel 461 are fixedly connected with brackets 465, and both sides of the control panel 461 are connected to the inner wall of the premixing cylinder 44 Fixedly connected, the top of the control pipe 462 runs through the rotating gear 47 and communicates with the feed port through a sealed bearing.

[0077] A control device 46 is provided. During use, the collet 464 is driven by the telescopic rod 463 to be clamped on both sides of the control tube 462. Th...

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Abstract

The invention discloses electronic component slurry and a processing technology thereof. The electronic component slurry comprises the following components in percentage by weight: 13-17% of a mixed solvent with the same amount of propyl acetate and isobutanol; 11%-13% of polyacrylic resin; 30%-35% of ferrite powder; 5%-8% of epoxy resin; 8%-10% of calcium phosphite; 8%-10% of calcium stearate; the preparation method comprises the following steps: putting an equivalent mixed solvent of propyl acetate and isobutanol, polyacrylic resin and calcium phosphite into a mixing device, uniformly mixing to obtain a mixture A, putting ferrite powder, epoxy resin, calcium stearate and the silane coupling agent into the mixing device, uniformly mixing to obtain a mixture B, and uniformly mixing to obtain a mixture C; the invention relates to the technical field of electronic component paste. According to the electronic component slurry and the processing technology thereof, a plurality of mixing devices do not need to be replaced, the use is relatively convenient, the processing efficiency is relatively high, the mixing sequence and interval of each premix added into the mixing box are conveniently and freely adjusted, and the adjustability is relatively good.

Description

technical field [0001] The invention relates to the technical field of slurry for electronic components, in particular to a slurry for electronic components and a processing technology thereof. Background technique [0002] Electronic component paste is the basic material for the manufacture of thick film components. It is a paste made of solid powder and organic solvents that are uniformly mixed by three-roll rolling. According to different uses, it is divided into dielectric paste, resistance paste and conductor paste. Paste: According to the type of substrate, it can be divided into ceramic substrate, polymer substrate, glass substrate and metal insulating substrate electronic paste, etc.; according to different sintering temperatures, it can be divided into high temperature, medium and low temperature drying electronic paste; According to different purposes, it can be divided into general electronic paste (making general thick film circuit) and special electronic paste (...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01F27/90B01F29/80B01F33/82B01F35/00B01F35/75
Inventor 陈云
Owner 淮安市宝鼎科技有限公司