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Static and dynamic three-dimensional microcrack propagation sensor preparation method, sensor and equipment

A micro-crack, static and dynamic technology, applied in the field of sensors, can solve the problems of loss of conductive layer, insensitivity to strain rate, poor flexibility of zinc sheets, etc., and achieve the effects of flexible size adjustment, fast and stable monitoring, and favorable sensitivity

Pending Publication Date: 2022-04-12
QINGDAO TECHNOLOGICAL UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the piezoresistive film sensor can only detect the static signal of the structure, but cannot perceive the deformation state of the structure, and is not sensitive to the strain rate.
Although the piezoelectric sensing film responds quickly, it is only suitable for detecting dynamic signals, such as transient force changes, deformation rates, etc., and cannot reflect the final strain state.
Therefore, the single-mode piezoresistive sensing film or piezoelectric sensing film will cause information loss in the process of structural static / dynamic signal detection. To solve these shortcomings, a static / dynamic dual-mode sensor is proposed.
[0007] Chinese patent CN105953821B discloses a piezoresistive / piezoelectric sandwich sensor for the first time, including: a tough substrate, 5-50 self-assembled thin film piezoresistive sensing functional layers (top / bottom electrode layer) and piezoelectric sensing elastic clips Core functional layer; among them, it is made of nano-ZnO / PDMS or PVDF / PDMS, which can effectively monitor static and dynamic signals, but the flexibility of the zinc sheet is poor. When the working surface is shaped The paste effect is not ideal, and the mechanical stability of the encapsulating elastomer and the conductive layer is insufficient under the action of external force, and the conductive layer is easy to separate from the elastomer and lose its effect
At the same time, this type of sensor has a thick film and poor sensitivity, so it is difficult to have high sensitivity and high flexibility at the same time

Method used

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  • Static and dynamic three-dimensional microcrack propagation sensor preparation method, sensor and equipment
  • Static and dynamic three-dimensional microcrack propagation sensor preparation method, sensor and equipment
  • Static and dynamic three-dimensional microcrack propagation sensor preparation method, sensor and equipment

Examples

Experimental program
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Effect test

Embodiment 1

[0043] refer to figure 1 , the present embodiment provides a static and dynamic three-dimensional micro-crack growth sensor preparation method, which includes:

[0044] Step 1: Prepare a piezoresistive / piezoelectric sensing functional material dispersion and attach it to the surface of the fiber cloth substrate to obtain a piezoresistive / piezoelectric sensing fiber cloth.

[0045] In step 1, the process of preparing piezoresistive / piezoelectric sensing functional material dispersion is:

[0046] Prepare piezoelectric functional material precursors;

[0047] Using the method of ultrasonic surfactant, the material with piezoresistive function is mixed and dispersed in the precursor liquid of piezoelectric functional material to obtain the dispersion material of piezoresistive / piezoelectric sensing functional material.

[0048] Wherein, the preparation of the piezoelectric functional material precursor can be prepared by a sol-gel method well known to those skilled in the art. T...

Embodiment 2

[0082] This embodiment provides a method for preparing a static and dynamic three-dimensional micro-crack growth sensor, which is different from the first embodiment in that the piezoresistive / piezoelectric sensing functional material in step 1 is different, and other steps are similar to the first embodiment.

[0083] In this embodiment, the preparation process of CNT piezoresistive sensing functional material dispersion is as follows:

[0084] Add 3 parts of CTAB and 1 part of CNT into 500 parts of deionized water, immerse the dispersion in ultrasonication for 5 minutes, and ultrasonicate with a 200W probe for 30 minutes to obtain a CNT slurry.

[0085] The process of introducing the CNT piezoresistive sensing functional material into the fiber cloth matrix is ​​as follows: refer to Step 1.1 and Step 1.2 in Example 1, dry at 80°C for 15 minutes after spraying, and repeat Step 1.4.

[0086] The process of introducing nano-zinc oxide (ZnO) piezoelectric sensing functional mate...

Embodiment 3

[0091] This embodiment provides a static and dynamic three-dimensional micro-crack propagation sensor preparation method, which is different from the first embodiment in that the piezoresistive sensing functional material used is reduced graphene oxide (rGO); the piezoelectric sensing functional material is nano-zinc oxide.

[0092] quasi-static d 33 / d 31 Measuring instrument to test the piezoelectric strain coefficient d of the rGO / ZnO piezoresistive / piezoelectric sensing three-dimensional microcrack functional skeleton 33 -25pC / N, d 31 It is -28pC / N, combined with Wheatstone bridge technology and DaspV11 dynamic signal acquisition technology to study the change of resistivity of the sensor under the condition of three-point bending in the middle span of simply supported beam system, the sensitivity is 211, the linearity is 0.98, and the dynamic When the strain acts, the sensor voltage change sensitivity is 220, and the linearity is 0.99. It can sensitively sense the stru...

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Abstract

The invention belongs to the technical field of sensors, and provides a static and dynamic three-dimensional microcrack propagation sensor preparation method, a sensor and equipment. The preparation method comprises the following steps: preparing a piezoresistive / piezoelectric sensing functional material dispersion material, and attaching the piezoresistive / piezoelectric sensing functional material dispersion material to the surface of a fiber cloth matrix to obtain piezoresistive / piezoelectric sensing fiber cloth; performing pre-stretching treatment on the piezoresistive / piezoelectric sensing fiber cloth to obtain piezoresistive / piezoelectric sensing three-dimensional microcrack fiber cloth; carrying out microwave ablation on the piezoresistive / piezoelectric sensing three-dimensional microcrack fiber cloth, and removing a fiber cloth matrix to obtain a piezoresistive / piezoelectric sensing three-dimensional microcrack functional skeleton; the two faces of the piezoresistive / piezoelectric sensing three-dimensional microcrack functional framework are coated with conducting layers correspondingly, and then electrodes are formed; carrying out polarization treatment on the piezoresistive / piezoelectric sensing three-dimensional microcrack functional skeleton with the electrode formed on the surface; and packaging the piezoresistive / piezoelectric sensing three-dimensional microcrack functional framework to obtain the static and dynamic three-dimensional microcrack propagation sensor.

Description

technical field [0001] The invention belongs to the technical field of sensors, and in particular relates to a method for preparing a static and dynamic three-dimensional micro-crack propagation sensor, a sensor and equipment. Background technique [0002] The statements in this section merely provide background information related to the present invention and do not necessarily constitute prior art. [0003] The sensor is the key link to realize structural health monitoring. Conducting piezoresistive materials (such as graphite, carbon black, carbon fiber, carbon nanotubes, graphene), piezoelectric ceramics (such as lead titanate, zinc oxide, lead zirconate titanate), etc. / Piezoelectric materials are mixed into cement concrete to make intrinsic sensing blocks, and cement-based piezoelectric sensing blocks need to undergo a series of treatments such as mixing, pressing, and polarization, and are embedded or embedded in various structural systems, which is complicated to op...

Claims

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Application Information

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IPC IPC(8): G01L1/16G01L1/20
CPCH10N30/045G01N2203/0066H10N30/092H10N30/302G01N3/08
Inventor 罗健林周晓阳聂华荣高乙博李治庆
Owner QINGDAO TECHNOLOGICAL UNIVERSITY
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