Unlock instant, AI-driven research and patent intelligence for your innovation.

A chip type high voltage capacitor

A high-voltage capacitor, chip type technology, applied in multiple fixed capacitors, fixed capacitor electrodes, fixed capacitor terminals, etc., can solve the problems of occupying circuit board space, soldering pins together, capacitors not working, etc., to avoid Short circuit, reduce the probability of failure, reduce the effect of temperature

Active Publication Date: 2022-05-24
深圳市康泰嵩隆电子科技有限公司
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing SMD high-voltage capacitors are usually directly soldered two or more capacitors directly on the circuit board when they are connected in parallel. If the capacitors are connected in parallel in this way, the space reserved on many circuit boards is relatively small, and Two or more capacitors are welded on the circuit board, which takes up more space on the circuit board, and when soldering, the pins are easily soldered together, which can easily cause the capacitors to fail to work

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A chip type high voltage capacitor
  • A chip type high voltage capacitor
  • A chip type high voltage capacitor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] like figure 1 and figure 2 As shown, it is the first embodiment of the present invention. This embodiment provides a chip type high-voltage capacitor, which includes a ceramic dielectric 1 and a parallel component. Terminal electrodes 2 are installed at both ends of the ceramic dielectric 1, and the two terminal electrodes 2. A plurality of first electrode sheets 3 and a plurality of second electrode sheets 4 are respectively fixed at one end of the ceramic medium 1, and the plurality of first electrode sheets 3 and the plurality of second electrode sheets 4 are alternately arranged inside the ceramic medium 1, and are connected in parallel. The component is installed at the end of the terminal electrode 2 away from the ceramic dielectric 1, and the parallel component is used to connect two high voltage chip capacitors in parallel.

[0036] When the invention is in use, the capacitors can be effectively connected in parallel, welding is avoided, the space occupied on ...

Embodiment 2

[0051] This embodiment is further improved on the basis of the first embodiment, and the difference from the first embodiment lies in the difference of the connecting piece.

[0052] like Figure 9 As shown, the connector includes a loop frame 18 and a heat conducting plate 19. The loop frame 18 is fixed on the lower end of the connecting body 6, and the heat conducting plate 19 is fixed inside the loop frame 18. The material of the heat conducting plate 19 is aluminum.

[0053] Specifically, through the design of the heat conducting plate 19 and the ring-shaped frame 18 , the isolation of the two L-shaped pins 5 is ensured, and the heat dissipation efficiency is improved.

[0054] The working principle of the present invention is as follows: when two high-voltage chip capacitors are connected in parallel, the high-voltage chip capacitors are first stacked on top of each other, and the parallel components of the lower chip high-voltage capacitors are connected in parallel with...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of chip capacitors, and specifically relates to a chip high-voltage capacitor, which includes a ceramic dielectric and a parallel assembly. Both ends of the ceramic dielectric are equipped with terminal electrodes, and the ends of the two terminal electrodes close to the ceramic medium are respectively fixed for multiple A first electrode sheet and a plurality of second electrode sheets are arranged alternately in the interior of the ceramic medium. Through the structural design of the parallel components, the present invention can effectively connect the capacitors in parallel, eliminating the need for welding, reducing the occupied space on the circuit board, and reducing the probability of failure; through the cooperation of the connecting body and the rectangular connecting plate, It can effectively isolate the two L-shaped pins when the L-shaped pins are soldered to the circuit board, avoiding the short circuit caused by the solder during welding; through the structural design of the first electrode sheet inside the ceramic dielectric, it can effectively reduce the capacitance The temperature during use increases the service life of the capacitor.

Description

technical field [0001] The invention belongs to the technical field of chip capacitors, and particularly relates to a chip type high-voltage capacitor. Background technique [0002] SMD capacitors are a kind of capacitor material. The full name of chip capacitors is: multilayer (multilayer, laminated) chip ceramic capacitors, also known as chip capacitors, chip capacitors, high-voltage chip capacitors, also known as ceramic multilayer chip capacitors, is a kind of ceramic powder production Technology, the interior is made of precious metal palladium, and silver is plated on ceramics as electrodes by high-temperature sintering. [0003] The existing SMD high-voltage capacitors are generally connected in parallel by directly soldering two or more capacitors on the circuit board. In this way, the capacitors are connected in parallel, and the space reserved on many circuit boards is relatively small, and the Two or more capacitors are soldered on the circuit board, which occup...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/38H01G4/005H01G4/232H01G4/224H01G4/002
Inventor 李阿明
Owner 深圳市康泰嵩隆电子科技有限公司