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Filter chip wafer plasma cutting pretreatment method

A filter and plasma technology, which is applied in the field of filter chip testing, can solve problems such as large differences in dicing line width, easy bridging phenomenon, and difficult coating of protective liquid.

Pending Publication Date: 2022-04-15
RF360 TECH (WUXI) CO LTD
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  • Claims
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Problems solved by technology

[0004] For the existing wafer dicing, the one-step spin coating method is used to apply the protective liquid, which makes it difficult to apply the protective liquid evenly, resulting in large differences in the width of the subsequent laser grooving dicing lines, which is prone to bridging, and ultimately affects the quality of the chip. In order to solve the problem of high efficiency, the present invention provides a pretreatment method for plasma cutting of filter chip wafers, which can ensure that the protective liquid can be coated evenly, so that the width of the subsequent laser cutting grooves is consistent, effectively preventing the occurrence of bridging, and improving the efficiency of the chip. Yield

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  • Filter chip wafer plasma cutting pretreatment method

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Embodiment Construction

[0016] A pretreatment method for plasma cutting of filter chip wafers, comprising the following steps:

[0017] Step 1. The pre-cut surface of the filter chip wafer faces upwards, and the bottom of the wafer is connected to the EGT composite film layer, and the bottom of the composite film layer is provided with a wafer ring support.

[0018] Step 2. Fix the filter wafer processed in step 1 on the wafer turntable, first control the wafer turntable to idle at a low speed of 5rpm / s for 10s, then turn on the protective liquid nozzle and spray 5~ on the surface of the filter chip wafer After 30ml of protection liquid, close the protection liquid nozzle, accelerate the wafer turntable to 2000rpm / s, and keep it for 30s, then turn on the deionized water nozzle to clean the surface of the filter wafer. At this time, the speed of the wafer turntable is 400rpm / s. The time is 60s, then adjust the wafer speed to 5rpm / s, and finally turn on the protective liquid nozzle again, spray 15~90 m...

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Abstract

The invention provides a pretreatment method for plasma cutting of a filter chip wafer, which can ensure that a protective liquid can be uniformly coated, so that the widths of subsequent laser cutting grooves are consistent, the bridging phenomenon is effectively prevented, and the chip yield is improved. By means of the two-step protection liquid spin-coating mode, the protection liquid is evenly and closely coated, meanwhile, the bubble phenomenon can be greatly reduced, etching black spots generated by bubbles are also reduced by about 90%, and the subsequent cutting quality is effectively guaranteed.

Description

technical field [0001] The invention relates to the technical field of filter chip testing, in particular to a pretreatment method for plasma cutting of a filter chip wafer. Background technique [0002] With the further shrinking of the chip size and the overall improvement of the factory automation level, the accuracy, speed and quality of the wafer cutting process are one of the important steps in the chip packaging process. Plasma cutting is more and more favored by people because of its advantages of high cutting efficiency and non-destructive processing. [0003] As a typical dry etching process, plasma cutting mainly generates plasma through high-voltage discharge, and chemically reacts with silicon-based chips under bias voltage. For the filter chip, in order to prevent the filter chip from dislocation, over-width, over-etching and other problems during the plasma cutting process, it is necessary to coat the cutting line with a layer of protective liquid for pre-cut...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304H01L21/683
CPCH01L21/304H01L21/6836H01L2221/68327
Inventor 杨昊东
Owner RF360 TECH (WUXI) CO LTD