Method for preparing tungsten on semiconductor wafer
A semiconductor and wafer technology, used in semiconductor/solid-state device manufacturing, coating, gaseous chemical plating, etc., can solve the problems of increased damage to the back of the wafer, deterioration, affecting product yield, etc., and reduce warpage. risk, protecting the backside of the wafer, reducing the effect of damage
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[0022] The method for preparing tungsten on a semiconductor wafer of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description. It should be understood that the drawings in the description are all in very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention. It should be noted that the order of the steps in the methods presented herein is not necessarily the only order in which the steps are performed, some described steps may be omitted and / or some other steps not described herein may be added to the method.
[0023] figure 1 is a schematic illustration of warping of a semiconductor wafer during tungsten chemical vapor deposition. refer to figure 1 , the semiconductor wafer 10 is placed ...
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