LED display device and preparation method and application thereof

A technology for display devices and light-emitting devices, applied in semiconductor devices, electrical components, coatings, etc., can solve the problems of long molding process cycle, single conductive modeling, unfavorable mass production, etc., and achieve industrial mass production, high thermal conductivity, etc. rate, reducing the effect of phonon scattering

Pending Publication Date: 2022-04-29
GUANGDONG VOCATIONAL & TECHNICAL COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the heat dissipation materials commonly used in packaging are mainly metal aluminum or ceramic materials. These materials have some defects in the actual use process. For example, although aluminum-based heat dissipation materials have relatively good heat dissipation capabilities, they have long molding process cycles and inherent Conductivity and single shape, etc., while ceramic materials are insulating, but their specificity is large and difficult to form, which is not conducive to mass production, and its application is also limited

Method used

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  • LED display device and preparation method and application thereof
  • LED display device and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] This embodiment is an LED display device and a manufacturing method thereof.

[0077] In this embodiment, the LED display device consists of figure 1 The structure shown consists of:

[0078] Including a driving circuit substrate 100;

[0079] Partial areas of the surface of the drive circuit substrate 100 are provided with electrode pins 101;

[0080] The surface of the electrode pin 101 is provided with an LED light emitting device 103;

[0081] The remaining area of ​​the surface of the driving circuit substrate 100 is provided with a first heat dissipation layer 102;

[0082] A second heat dissipation layer 104 is provided on the surface of the first heat dissipation layer 102 and the surface of the LED light emitting device 103;

[0083] The surface of the second heat dissipation layer 104 is provided with a third heat dissipation layer 105;

[0084] The surface of the third heat dissipation layer 105 is provided with a fourth heat dissipation layer 106;

[0...

Embodiment 2

[0102] This embodiment is an LED display device and a manufacturing method thereof.

[0103] In this embodiment, the LED display device consists of figure 1 The structure shown consists of:

[0104] Including a driving circuit substrate 100;

[0105] Partial areas of the surface of the drive circuit substrate 100 are provided with electrode pins 101;

[0106] The surface of the electrode pin 101 is provided with an LED light emitting device 103;

[0107] The remaining area of ​​the surface of the driving circuit substrate 100 is provided with a first heat dissipation layer 102;

[0108] A second heat dissipation layer 104 is provided on the surface of the first heat dissipation layer 102 and the surface of the LED light emitting device 103;

[0109] The surface of the second heat dissipation layer 104 is provided with a third heat dissipation layer 105;

[0110] The surface of the third heat dissipation layer 105 is provided with a fourth heat dissipation layer 106;

[0...

Embodiment 3

[0128] This embodiment is an LED display device and a manufacturing method thereof.

[0129] In this embodiment, the LED display device consists of figure 1 The structure shown consists of:

[0130] Including a driving circuit substrate 100;

[0131] Partial areas of the surface of the drive circuit substrate 100 are provided with electrode pins 101;

[0132] The surface of the electrode pin 101 is provided with an LED light emitting device 103;

[0133] The remaining area of ​​the surface of the driving circuit substrate 100 is provided with a first heat dissipation layer 102;

[0134] A second heat dissipation layer 104 is provided on the surface of the first heat dissipation layer 102 and the surface of the LED light emitting device 103;

[0135] The surface of the second heat dissipation layer 104 is provided with a third heat dissipation layer 105;

[0136] The surface of the third heat dissipation layer 105 is provided with a fourth heat dissipation layer 106;

[0...

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Abstract

The invention discloses an LED display device and a preparation method and application thereof, and the LED display device comprises a driving circuit substrate; electrode pins are arranged in a partial region of the first surface of the driving circuit substrate; an LED light-emitting device is arranged on the surface of the electrode pin; a first heat dissipation layer is arranged in the remaining area of the first surface of the driving circuit substrate; a second heat dissipation layer is arranged on the surface of the first heat dissipation layer and the surface of the LED light-emitting device; and a third heat dissipation layer is arranged on the surface of the second heat dissipation layer. Wherein the first heat dissipation layer achieves the effects of homogenizing a thermal field and primarily dissipating heat, heat is prevented from being concentrated in the LED light-emitting device, the second heat dissipation layer and the third heat dissipation layer further conduct heat of the LED light-emitting device and the first heat dissipation layer, heat dissipation guiding is formed through the multiple heat dissipation layers, and the overall heat dissipation efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of display devices, in particular to an LED display device and a preparation method and application thereof. Background technique [0002] As a new generation of light source, LED has the advantages of high efficiency, energy saving, environmental protection, long service life, and easy maintenance. It is expected to be the third generation of light source that can replace incandescent and fluorescent lamps. Directly related, the heat dissipation problem is the main problem that limits the power and luminous efficiency of packaged products. The effective way to solve the heat dissipation problem is to use high thermal conductivity, high insulation, and high transmittance materials to quickly transfer heat out. At present, the heat dissipation materials commonly used in packaging are mainly metal aluminum or ceramic materials. These materials have some defects in the actual use process. For example, although ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64C23C16/32C23C16/34C23C16/40
CPCH01L33/641H01L33/647C23C16/325C23C16/345C23C16/401
Inventor 邓文剑张媛媛
Owner GUANGDONG VOCATIONAL & TECHNICAL COLLEGE
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