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A kind of mxene/metal composite airgel, its preparation method, application and thermal interface material comprising it

A composite airgel and metal composite technology, applied in the field of thermally conductive materials, can solve problems such as limited thermal conductivity

Active Publication Date: 2022-01-04
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Based on the structure of the three-dimensional graphene / silver nanoparticle airgel, it is speculated that it may have certain thermal conductivity, but the silver nanoparticles in this airgel are only adsorbed on the surface of graphene, and its thermal conductivity is limited.

Method used

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  • A kind of mxene/metal composite airgel, its preparation method, application and thermal interface material comprising it
  • A kind of mxene/metal composite airgel, its preparation method, application and thermal interface material comprising it
  • A kind of mxene/metal composite airgel, its preparation method, application and thermal interface material comprising it

Examples

Experimental program
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Effect test

Embodiment 1

[0057] This embodiment provides an MXene / silver composite airgel, which includes an MXene skeleton and silver, and the MXene skeleton is cross-linked by silver to form a network structure.

[0058] Concrete preparation method is as follows:

[0059] (1) Dissolve 2g of lithium fluoride in 20mL of hydrochloric acid (9mol / L), then 2g of MAX(Ti 3 AlC 2 ) powder into the above solution, stirred at room temperature for 24 hours for etching, the etched sample was washed and collected by centrifugation, then dispersed in deionized water, mechanically shaken for 5 minutes, centrifuged at 3500 rpm for 30 minutes, collected Clear liquid, namely MXene(Ti 3 C 2 ) dispersion (concentration of about 0.7mg / mL);

[0060] (2) Take 200mL of the MXene dispersion obtained in step (1), drop 1mL of silver nitrate solution with a concentration of 0.5mol / L, and after fully stirring, ultrasonically vibrate the mixture in an ice bath for 30 minutes to reduce the silver ions Form silver nanoparticle...

Embodiment 2

[0065] This embodiment provides an MXene / silver composite airgel, which includes an MXene skeleton and silver, and the MXene skeleton is cross-linked by silver to form a network structure.

[0066] Concrete preparation method is as follows:

[0067] (1) Dissolve 2g of lithium fluoride in 20mL of hydrochloric acid (9mol / L), then 2g of MAX(Ti 2 AlC) powder was added to the above solution, stirred at room temperature for 24 hours for etching, the etched sample was washed and collected by centrifugation, then dispersed in deionized water, mechanically shaken for 5 minutes, centrifuged at 3500 rpm for 30 minutes, collected The supernatant is MXene(Ti 2 C) dispersion liquid;

[0068] (2) Take 200mL of the MXene dispersion obtained in step (1), drop 1mL of silver nitrate solution with a concentration of 1mol / L, and after fully stirring, ultrasonically vibrate the mixture in an ice bath for 30 minutes to reduce the silver ions to Silver nanoparticles are centrifuged to remove the s...

Embodiment 3

[0072]This embodiment provides an MXene / silver composite airgel, which includes an MXene skeleton and silver, and the MXene skeleton is cross-linked by silver to form a network structure.

[0073] Concrete preparation method is as follows:

[0074] (1) Dissolve 2g lithium fluoride in 20mL hydrochloric acid (9mol / L), then 2g MAX (V 2 AlC) powder was added to the above solution, stirred at room temperature for 24 hours for etching, the etched sample was washed and collected by centrifugation, then dispersed in deionized water, mechanically shaken for 5 minutes, centrifuged at 3500 rpm for 30 minutes, collected The supernatant is MXene (V 2 C) dispersion liquid;

[0075] (2) Take 200mL of the MXene dispersion obtained in step (1), drop 1mL of silver nitrate solution with a concentration of 2mol / L, and after fully stirring, ultrasonically vibrate the mixture in an ice bath for 30 minutes to reduce the silver ions to Silver nanoparticles are centrifuged to remove the supernatant...

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Abstract

The invention provides an MXene / metal composite airgel, its preparation method, application and a thermal interface material containing it. The MXene / metal composite airgel includes an MXene skeleton and a metal, and the MXene skeleton is cross-linked into a network structure through the metal. The MXene / metal composite airgel is firstly reacted with metal salts to reduce metal ions into metal nanoparticles in situ, then forms a network structure by ice template method and freeze-dries, and finally anneals to melt the metal nanoparticles. The method of "welding" MXene sheets was prepared. The MXene / metal composite airgel provided by the invention has good thermal conductivity, structural stability and thermal conductivity stability, can be used as a thermally conductive filler, and is used to prepare thermal interface materials, and has good compatibility with organic polymer materials , has a wide range of applications for polymer substrates.

Description

technical field [0001] The invention belongs to the technical field of thermally conductive materials, and in particular relates to an MXene / metal composite airgel, its preparation method, application and a thermal interface material containing the same. Background technique [0002] Thermal interface material is a general term for a class of materials that are placed between heat dissipation devices and heat generating devices to reduce the contact thermal resistance between them. When the heat dissipation device is in contact with the heat generating device, there is inevitably a gap, and the thermal conductivity of air is very small, so there will be a large contact thermal resistance between the interfaces. The use of thermal interface materials can well fill this gap and improve heat dissipation. performance. [0003] However, with the miniaturization, high density and high power of integrated circuits, the heat dissipation of electronic components has severely limited...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L29/04C08K3/14C08K3/08C08J9/28C09K5/14
CPCC08J9/28C09K5/14C08J2329/04C08J2201/0484C08K2201/011C08K3/14C08K2003/0806
Inventor 闫长增纪超王英孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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